Experimental Investigation of Porous Micro Heat Sink for Electronics Cooling Application

Abstract:

A novel porous micro heat sink system was presented for dissipating high heat fluxes of electronic device. The flow and heat transfer of porous micro heat sink was investigated by experiment at the condition of high heat fluxes, and the results showed that the heat load of up to 280W was removed by the heat sink, and the heater junction temperature was 63.8°C at the coolant flow rate of 5.1cm³/s. The whole heat transfer coefficient of heat sink increased with the increases of coolant flow rate and heat load, and the maximal heat transfer coefficient was 33kW(m².°C)^-1 in the experiment. The minimum value of 0.19°C/W for whole thermal resistance of heat sink was achieved at flow rate of 5.1cm³/s, and increasing of coolant flow rate and heat fluxes could decrease the thermal resistance.

• Periodical: Advanced Materials Research (Volumes 204-210)
• Pages: 2023-2026
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.204-210.2023
• Online since: February 2011
• Authors: Ka Lin Su, Jing Liu, Jun Rong, Jun Hua Wan
• Keywords: Experimental Investigation, Heat Sink, Heat Transfer, High Heat Flux, Porous Medium

References

[1] A. Sivasamy, V. Selladurai: nternational Journal of Thermal Sciences, Vol. 49 (2010), p.1238.

[2] X.B. Luo, S. Liu: IEEE Transactions on Advanced Packaging, Vol. 30-33 (2007), p.475.

[3] C. Adam, G. Samuel: Applied Thermal Engineering, Vol. 29 (2009), p.364.

[4] A.W. Mauro, J.R. Thom: Experimental Thermal and Fluid Science, Vol. 34 (2010), p.81.

[5] E.S. Cho, J.W. Choi: International Journal of Heat and Mass Transfer, Vol. 53 (2010), p.2159.

[6] A. Christensen, S. Graham: Applied Thermal Engineering, Vol. 29 (2009), p.364.

[7] J.M. Kang, J.W. Kim, J.H. Choi: Microelectronics Reliability, Vol. 49 (2009), p.1231.

[8] Z.B. Yan, K.C. Toh, F. Duan: Applied Thermal Engineering, Vol. 30, (2010), p.1225.