Silicon-containing epoxy resin (CNE-Si) was synthesized from diphenylsilandiol (DPSD) and ortho-cresol novolac epoxy resin using SnCl2 as catalyst. The chemical structure of CNE-Si prepared in this paper was characterized by 1H-NMR and FTIR. The thermal stability was analyzed by TGA. The result showed that the –Si- group enhanced the thermal stability of the epoxy resin. The curing kinetics of the system was studied by non-isothermal DSC. The kinetic parameters of the curing reaction including the activation energy were calculated using Kissinger and Ozawa method. The results showed that the system containing CNE-Si has lower curing temperature and more quick curing speed compared to CNE, which can be used for manufacturing the quick-curing EMCs or afterward-curing-free EMCs.