The Synthesis of Silicon-Containing Epoxy Resin and its Application in Environmentally-Friendship Epoxy Molding Compound for IC Packaging

Abstract:

Silicon-containing epoxy resin (CNE-Si) was synthesized from diphenylsilandiol (DPSD) and ortho-cresol novolac epoxy resin using SnCl₂ as catalyst. The chemical structure of CNE-Si prepared in this paper was characterized by 1H-NMR and FTIR. The thermal stability was analyzed by TGA. The result showed that the –Si- group enhanced the thermal stability of the epoxy resin. The curing kinetics of the system was studied by non-isothermal DSC. The kinetic parameters of the curing reaction including the activation energy were calculated using Kissinger and Ozawa method. The results showed that the system containing CNE-Si has lower curing temperature and more quick curing speed compared to CNE, which can be used for manufacturing the quick-curing EMCs or afterward-curing-free EMCs.

• Periodical: Advanced Materials Research (Volumes 211-212)
• Pages: 638-642
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.211-212.638
• Online since: February 2011
• Authors: Ming Shan Yang, Jian Wei Liu, Lin Kai Li
• Keywords: Environmentally Friendship Retardance, Epoxy Molding Compound, Large-Scale Integrated Circuit Packaging, Silicon-Containing Epoxy Resin, Synthesis

References

[1] J. Xu, G. C. Sun, W. S. Wang. Study on Organosilicon Modified Epoxy. Shandong Science, Vol. 10, No. 4(1997), p.57.

[2] X. W. Jia, Z. G. Liu. Research Progress on Silicon-based Flame Retardants. Chemical Industry and Engineering Progress, Vol. 22, No. 8(2003), pp.818-821.

[3] L. A. Mercado, M. Galia, J. A. Reina. Silicon-containing flame retardant epoxy resins: Synthesis, characterization and properties. Polymer Degradation and Stability, Vol. 91(2006), pp.2588-2594.

DOI: 10.1016/j.polymdegradstab.2006.05.007

[4] K. S. Ananda, Z. Denchev, M. Alagar. Synthesis and thermal characterization of phosphorus containing siliconized epoxy resins. J. European Polymer, Vol. 6, No. 10(2006), pp.1-2.

DOI: 10.1016/j.eurpolymj.2006.06.010

[5] W. J. Wang, L. H. Perng, G. H. Hsiue, F. C. Chang. Characterization and properties of new silicone-containing epoxy resin. Polymer, Vol. 41(2000), pp.6113-6114.

DOI: 10.1016/s0032-3861(99)00790-9

[6] B. Zhang, W. Q. Liu. The synthesis and Properties of Organic Silicon-Modified Epoxy Resin. Guangzhou Chemisty, Vol. 27, No. 1(2002), pp.6-7.

[7] H. F. ZHOU. Study on curing kinetic parameter for polyimide resin. Thermosetting Resin，Vol. 20, No. 4(2005), pp.11-13.