The Synthesis of Silicon-Containing Epoxy Resin and its Application in Environmentally-Friendship Epoxy Molding Compound for IC Packaging

Abstract:

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Silicon-containing epoxy resin (CNE-Si) was synthesized from diphenylsilandiol (DPSD) and ortho-cresol novolac epoxy resin using SnCl2 as catalyst. The chemical structure of CNE-Si prepared in this paper was characterized by 1H-NMR and FTIR. The thermal stability was analyzed by TGA. The result showed that the –Si- group enhanced the thermal stability of the epoxy resin. The curing kinetics of the system was studied by non-isothermal DSC. The kinetic parameters of the curing reaction including the activation energy were calculated using Kissinger and Ozawa method. The results showed that the system containing CNE-Si has lower curing temperature and more quick curing speed compared to CNE, which can be used for manufacturing the quick-curing EMCs or afterward-curing-free EMCs.

Info:

Periodical:

Advanced Materials Research (Volumes 211-212)

Edited by:

Ran Chen

Pages:

638-642

DOI:

10.4028/www.scientific.net/AMR.211-212.638

Citation:

M. S. Yang et al., "The Synthesis of Silicon-Containing Epoxy Resin and its Application in Environmentally-Friendship Epoxy Molding Compound for IC Packaging", Advanced Materials Research, Vols. 211-212, pp. 638-642, 2011

Online since:

February 2011

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Price:

$35.00

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