Dielectric and Hot/Wet Properties of Methyl-Silsesquioxane/Cyanate Ester Resin Hybrid Materials

Zeng Ping Zhang; Yong Wen; Hong Zhao Du; Jian Zhong Pei; Shuan Fa Chen

doi:10.4028/www.scientific.net/AMR.216.630

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 216Dielectric and Hot/Wet Properties of...

Dielectric and Hot/Wet Properties of Methyl-Silsesquioxane/Cyanate Ester Resin Hybrid Materials

Abstract:

Methylsilsesquioxane (Me-SSQ) was incorporated into cyanate ester resin (CE) to obtain organic-inorganic hybrids with better dielectric properties in this study. First, methyltriethoxysilane was hydrolyzed and condensed to synthesize Me-SSQ. Then several Me-SSQ/CE hybrids containing different contents of Me-SSQ were prepared. The effect of Me-SSQ content on the dielectric and hot/wet properties of materials was investigated. Results showed that the Me-SSQ/CE hybrid containing 20wt% of Me-SSQ shows a dielectric constant of 2.78, which is much lower than the pure CE resin. At the same time, the dielectric loss of the Me-SSQ/CE hybrids was slightly increased (tanδ<0.006). It indicates that Me-SSQ/CE hybrid is a promising matrix materials for high-performance printed circuit board (PCB).

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Periodical:

Advanced Materials Research (Volume 216)

Pages:

630-634

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.216.630

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Online since:

March 2011

Authors:

Zeng Ping Zhang, Yong Wen, Hong Zhao Du, Jian Zhong Pei, Shuan Fa Chen

Keywords:

Dielectric Property, Inorganic-Organic Hybrid Material, Silsesquioxane (SSO)

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