Attached FBG Strain Sensor Based on Thermal Stress Mechanism

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Abstract:

Based on a novel thermal stress mechanism, a attached FBG strain sensor with temperature-compensated function was designed and manufactured. This sensor cannot only compensate temperature drift but enhance stain sensitivity. The results are as follows: this package was shown to have a near 2.0 pm/°C shift and a high strain sensitivity of 1.9pm/με in this proposed self-compensated package.

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91-95

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March 2011

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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[1] KODINDOUMA M B, IDRISS R L, A D KERSEY, in: Smart Structures and Materials 1996: Smart Systems for Bridges, Structures, and Highways, Bellingham, WA, USA (1996).

DOI: 10.1117/12.238832

Google Scholar

[2] MINHO S ; BAE L S ; SAM C S , in: Proceedings of the 1997 Conference on Lasers and Electro-Optics, CLEO, Piscataway, NJ, USA (1997).

Google Scholar

[3] G.W. Yoffe, P.A. Krug, F. Ouellette: Applied Optics, Vol. 34(1995) , p.6859.

Google Scholar

[4] L. Yuan: Opt. Eng. Vol. 40 (2001), p.698.

Google Scholar

[5] J.J. Pan, P Ma, and Y Shi, in: Proc. Nat. Fiber Opt. Eng. Conf., San Diego, CA (1997).

Google Scholar

[6] Tsai, H. -H, Jang, W. -Y., Yeh, F. -F: IEEE Transactions on Advanced Packaging, Vol. 24( 2001), p.86.

Google Scholar

[7] T Iwashima, A Inoue, Shifgematsu M: Electronics letters, Vol. 33 (1997), p.417.

Google Scholar

[8] David Weidman: Laser Focus World, Vol. 5(1999), p.99.

Google Scholar

[9] Yu Gang, Cao Dan: Proc of SPIE Vol. 5623, p.32.

Google Scholar