Attached FBG Strain Sensor Based on Thermal Stress Mechanism

Abstract:

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Based on a novel thermal stress mechanism, a attached FBG strain sensor with temperature-compensated function was designed and manufactured. This sensor cannot only compensate temperature drift but enhance stain sensitivity. The results are as follows: this package was shown to have a near 2.0 pm/°C shift and a high strain sensitivity of 1.9pm/με in this proposed self-compensated package.

Info:

Periodical:

Edited by:

Yuhang Yang, Xilong Qu, Yiping Luo and Aimin Yang

Pages:

91-95

DOI:

10.4028/www.scientific.net/AMR.216.91

Citation:

J. Z. Li et al., "Attached FBG Strain Sensor Based on Thermal Stress Mechanism", Advanced Materials Research, Vol. 216, pp. 91-95, 2011

Online since:

March 2011

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Price:

$35.00

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