Improved Thermal Conductivity of Compostie Particles Filled Epoxy Resin

Abstract:

E-44 epoxy resin was used as matrix，and silicon nitride，boron nitride，alumina and silicon carbide were used as heat-conducting insulating fillers. By selecting the amounts and types of the insulting fillers, the heat conductive properties of E-44 could be adjusted. In addition, by choosing the curing agent and accelerator the viscosity of E-44 could also be readily controlled. The relation among the adhesive viscosity，heat conductive property and prescription was studied. When the amounts of silicon nitride, alumina and boron nitride were 25%, 25%, 10% (based on the mass of epoxy resin matrix), respectively, the thermal conductivity of this system was 2.66 W/mK.

• Periodical: Advanced Materials Research (Volumes 217-218)
• Pages: 439-444
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.217-218.439
• Online since: March 2011
• Authors: Xiu Ju Zhang, Zhi Dan Lin, Bo Li, Shao Zao Tan
• Keywords: Electronic Packaging, Epoxy Resin (ER), Heat-Conducting Insulating Filler, Tensile Strength, Thermal Conductivity (TC)

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