Preparation and Characterization of High-k Copper-Phthalocyanine/Polyimide Composites with Outstanding Thermal Stability

Abstract:

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Materials used for microelectronic devices need to have more multifunctional properties, such as excellent mechanical, thermal, and dielectric properties at the same time. In this paper, copper phthalocyanine/polyimide (CuPc/PI) composite films with high dielectric permittivity (k=9.9 with the volume fraction of CuPc is 28% at 100Hz) and high thermal stability are prepared by an in-situ polymerization process. The composite films show good dielectric properties and is almost independent of frequency in the measured frequency range up to 104 Hz. Notablely, The composites remain stable until the temperature reaches 500oC. In addition, the inclusion of CuPc slow down the composite degradation rate when the temperature is higher than 550oC. The resultant high performance of such polymer composites makes them attractive for technological applications in flexible high-k components.

Info:

Periodical:

Advanced Materials Research (Volumes 217-218)

Edited by:

Zhou Mark

Pages:

697-700

DOI:

10.4028/www.scientific.net/AMR.217-218.697

Citation:

J. W. Shang et al., "Preparation and Characterization of High-k Copper-Phthalocyanine/Polyimide Composites with Outstanding Thermal Stability", Advanced Materials Research, Vols. 217-218, pp. 697-700, 2011

Online since:

March 2011

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Price:

$35.00

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