For Libraries For Publication Open Access Downloads About Us Contact Us
Paper Titles
Effect of Carbon Addition on the Microstructure and Mechanical Properties of the In Situ Formed TiAl/Ti2AlC Composites
p.680
Reactive Synthesis of TiAl/Ti5Si3 In Situ Composites
p.684
Tribological Behavior of Poly(ethylene Glycol)-Carbon Nanotubes
p.688
Effect of Melt Overheating History on the Microstructure of Ni-Base Single Crystal Superalloy
p.692
Preparation and Characterization of High-k Copper-Phthalocyanine/Polyimide Composites with Outstanding Thermal Stability
p.697
Data Analysis and Forecast for Aircraft Structure Impact Damage Based on GP Symbolic Fitting Method
p.701
Calculation Method of the Horizontal Displacement on the Multi-Grid Composite Wall-Shear Wall Structure
p.706
Research on the Formula of Vibration Period of Multi-Ribbed Composite Slab Structure
p.712
Mechanics Analysis of Beam-Like Space Deployable Truss Mast
p.717

Preparation and Characterization of High-k Copper-Phthalocyanine/Polyimide Composites with Outstanding Thermal Stability

Article Preview

Abstract:

Materials used for microelectronic devices need to have more multifunctional properties, such as excellent mechanical, thermal, and dielectric properties at the same time. In this paper, copper phthalocyanine/polyimide (CuPc/PI) composite films with high dielectric permittivity (k=9.9 with the volume fraction of CuPc is 28% at 100Hz) and high thermal stability are prepared by an in-situ polymerization process. The composite films show good dielectric properties and is almost independent of frequency in the measured frequency range up to 104 Hz. Notablely, The composites remain stable until the temperature reaches 500oC. In addition, the inclusion of CuPc slow down the composite degradation rate when the temperature is higher than 550oC. The resultant high performance of such polymer composites makes them attractive for technological applications in flexible high-k components.

You might also be interested in these eBooks
High Performance Structures and Materials Engineering View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 217-218)

Pages:

697-700

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.217-218.697

Citation:

Cite this paper

Online since:

March 2011

Authors:

Ji Wu Shang, Yi He Zhang, Yu Li, Feng Zhu Lv

Keywords:

Composite, Copper Phthalocyanine, High-k, Polyimide, Thermal Stability

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2011 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] M. Arbatti, X.B. Shan, and Z.Y. Cheng: Adv. Mater. VOL. 19 (2007), p.1369.

Google Scholar

[2] L. Wang and Z.M. Dang: Appl. Phys. Lett. VOL. 87 (2005), pp.042903-1.

Google Scholar

[3] C. Pecharromán and J.S. Moya: Adv. Mater. VOL. 12 (2000), p.294.

Google Scholar

[4] L. Q, B.I. Lee, W.D. Samuels and G.J. Exarhos: Adv. Mater. VOL. 17 (2005), p.1778.

Google Scholar

[5] Q. M. Zhang, H.F. Li, M. Poh, F. Xia, H.S. Xu and C. Huang: Nature VOL. 419 (2002), p.284.

Google Scholar

[6] J.W. Wang, Y. Wang, F. Wang, S.Q. Li, J. Xiao and Q.D. Shen: Polymer VOL. 50 (2009), p.679.

Google Scholar

[7] Z.M. Dang, T. Zhou and S.H. Yao: Adv. Mater. VOL. 21 (2009), p. (2077).

Google Scholar

[8] Y.H. Zhang, S.G. Lu and Y.Q. Li: Adv. Mater, 17 (2005), p.1056.

Google Scholar

[9] Y.H. Zhang, Y. Li and H T Huang: Key Eng. Mater, 821 (2007), pp.334-335.

Google Scholar

[10] B.N. Achar, G.M. Fohlem and J.A. Parker: J. Polym. Sci. Part A Polym. Chem. VOL. 20 (1982), p.1785.

Google Scholar

© 2025 Trans Tech Publications Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For open access content, terms of the Creative Commons licensing CC-BY are applied.
Scientific.Net is a registered trademark of Trans Tech Publications Ltd.