A Study on Elliptical Vibration Cutting by Finite Element Analysis

Abstract:

In order to reveal the mechanistic characteristics during the elliptical vibration cutting (EVC), A simplified 2-D finite element model is developed. The characteristics of the cutting forces during the EVC process are investigated by comparison with the conventional cutting. The results indicate that the lower averaging values of cutting forces can be obtained and an obvious inverse phenomenon of the thrust force is also observed during the EVC process, which may be beneficial to the chip formation. A detailed analysis of the equivalent stress distribution during the EVC process is carried out. A transient stress distribution is observed during the EVC process, the highly localized Von Mises stress in the tool-chip contact region throughout one EVC cycle may help to form a more continuous chip and lead to the ductile regime removal of brittle materials.

• Periodical: Advanced Materials Research (Volumes 230-232)
• Pages: 1029-1033
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.230-232.1029
• Online since: May 2011
• Authors: Xiao Qin Zhou, Shao Xin Zhao, Zhi Wei Zhu, Jie Qiong Lin, Dan Luo
• Keywords: Cutting Force, Elliptical Vibration Cutting, Equivalent Stress Distribution, Finite Element Analysis (FEA)

References

[1] E. Shamoto, T. Moriwaki: CIRP Annals, Vol. 43 (1994), p.35 – 38.

[2] T. Moriwaki, E. Shamoto: CIRP Annals, Vol. 44 (1995), p.31 – 34.

[3] C. Nath, M. Rahman, K. S. Neo: Journal of Materials Processing Technology, Vol. 209 (2009), p.4459–4464.

[4] N. Suzuki, Z. Yan, R. Hino, et al.: 2006 International Symposium on Micro-Nano Mechantronics and Human Science (2006), Nagoya, Japan.

[5] C. Nath, M. Rahman, K. Neo: Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 27 (2009), p.1241.

[6] D. E. Brehl, T. A. Dow: Proceedings of the ASPE Topical Meeting on Vibration Assisted Machining Technology (2007), Chapel Hill.

[7] C. Ma, E. Shamoto, T. Moriwaki: International Journal of Machine Tools & Manufacture, Vol. 44 (2004), p.1305 – 1310.

[8] M. J. Nategh, S. Amini, H. Soleimanimehr, et al.: Mech. & Aerospace Eng. J., Vol. 4 (2009), p.83 – 91.

[9] S. Amini, M. J. Nategh, H. Soleimanimehr: Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, Vol. 223 (2009), p.641 – 652.

DOI: 10.1243/09544054jem1373

[10] G. D. Kim, B. G. Loh: Journal of Materials Processing Technology, Vol. 190 (2007), p.181 – 188.

[11] Y. Liang, D. Li, Q. Bai, et al: Proc. of the 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems (2006), Zhuhai, China.

[12] A. V. Mitrofanov, V. I. Babitsky, V. V. Silberschmidt: Computational Materials Science, Vol. 28 (2003), p.645–653.

DOI: 10.1016/j.commatsci.2003.08.020

[13] S. Amini, H. Soleimanimehr, M. J. Nategh, et al: Journal of materials processing technology, Vol. 201 (2008), p.43 – 47.

[14] K. S. Woon, M. Rahman, F. Z. Fang, et al: Journal of materials processing technology, Vol. 195 (2008), p.204 – 211.

[15] X. Lai, H. Li, C. Li, et al: International Journal of Machine Tools & Manufacture, Vol. 48 (2008), p.1 – 14.

[16] T. Özel, E. Zeren: Proceedings of IMECE (2005), Orlando, Florida, USA.