Research on Miniaturized and Portable Impedance-Measuring Device for Structural Health Monitoring

Yu Xiang Zhang; Dong Dong Wen; Hua Cheng Li; Fu Hou Xu

doi:10.4028/www.scientific.net/AMR.230-232.587

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Transient Dynamics Simulation of Helical Gear Pair Based on ANSYS
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Research on Miniaturized and Portable Impedance-Measuring Device for Structural Health Monitoring
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 230-232Research on Miniaturized and Portable...

Research on Miniaturized and Portable Impedance-Measuring Device for Structural Health Monitoring

Abstract:

Electromechanical impedance technique which based on smart material is a new method for structural damage detection, and it could be widely applied in structural health monitoring field. However, a very expensive and bulky analyzer is being used to measure the impedance, which is not practical for on-line system. Therefore, this paper developed a device that can measure the electric impedance using small modular electric components and reasonable circuit. Experiments are carried out to test the aluminum beam crack. Results indicate that the device can measure the electric impedance and detect the damage effectively. The proposed method provides a solution to miniaturize the impedance-measuring equipment and reduce the cost of measurement.

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Periodical:

Advanced Materials Research (Volumes 230-232)

Pages:

587-591

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.230-232.587

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Online since:

May 2011

Authors:

Yu Xiang Zhang, Dong Dong Wen, Hua Cheng Li, Fu Hou Xu

Keywords:

Damage, Device, Electromechanical Impedance Technique, Impedance Measurement, Structural Health Monitoring (SHM)

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