Simulation and Test of Bistable Inductive Micro-Switch

Article Preview

Abstract:

Inductive micro-switch is an integrative device of a sensor and actuator. It can not only induce an external acceleration, but can also be controlled by the external acceleration to realize the trigger action. However, its malfunctions related to “fail-to-closure” and “transient-closure” result in low reliability and weak anti-jamming capability. A new bistable inductive micro-switch is presented based on micro size adhesive effect. The dynamic simulation is obtained by Comsol software. The simulation shows the threshold acceleration is 23.6g, and the response time is 0.38ms. The micro-switch is tested by a centrifuge. The test result shows that the threshold acceleration is 24g.The relative error between the theoretical analysis and the test result is only 1.6%.

You might also be interested in these eBooks

Info:

Periodical:

Advanced Materials Research (Volumes 230-232)

Pages:

779-783

Citation:

Online since:

May 2011

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2011 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] G. Chen, et al: Information of Inertial Switch, Information and Electricity, Vol. 7(5), 439-442 (2009), in Chinese.

Google Scholar

[2] R. Pvan Kampen, R. F. Wolffenbuttel: Modeling the Mechanical Behavior of Bulk-micro Machined Silicon Accelerometers, Sensors and Actuators A, Vol. 64(1), pp.137-150 (1998).

DOI: 10.1016/s0924-4247(98)80007-1

Google Scholar

[3] J. Tsay, L. Q. Su and C. K. Sung: Design of a Linear Micro-feeding System Featuring Bistable Mechanics, J. Micromech. Microeng, Vol. 15 (1), pp.63-70(2005).

DOI: 10.1088/0960-1317/15/1/010

Google Scholar

[4] C. N. Oguibe, S. H. Mannan, D. C. Whalley, et a1, Conduction Mechanisms in Anisotropic Conducting Adhesive Assembly, IEEE Transactions on Components Packaging Technologies, Manufacturing Technology, part A, Vol. 21(2), pp.235-242(1998).

DOI: 10.1109/95.705469

Google Scholar

[5] Y. Fu, M. Willanter and J. Liu: Statistics of Electric Conductance through Anisotropically Conductive Adhesive, IEEE Transactions on Components and Packaging Technologies, Vol. 24(2), pp.250-255(2001).

DOI: 10.1109/6144.926390

Google Scholar

[6] Tilmans H. A.: Micro Resonant Force Gauges, Sensors and Actuators A, pp. Vol. 30(1), 35-539(1992).

Google Scholar

[7] Jian Zhao, Jianyuan Jia, Hongxi Wang andYanjie Gou: A V-shaped Beam Structure of the Bistable Inertia Switch, Aeronautics, Vol. 29 (5) , 1157-1162, (2008), in Chinese.

Google Scholar

[8] Hu Jun, Yang Bo: Vibration Resistance Design to Improve the Acceleration, Sensors and Micro Systems, Vol. 26 (2), pp.56-57(2007), in Chinese.

Google Scholar

[9] Yingmin Zhu, Jianyuan Jia, Hongqi Fan: The Air Damping of Dreadmill Exercise for MEMS Devices, Journal of Xidian University, Vol. 36 (5), 965-968, (2007), in Chinese.

Google Scholar

[10] Wenchao Tian, Huorong Ren, Linbin Wang and Huanling Liu: Sticking Analysis of the Bistable Inductive Micro-switch, Advanced Materials Research, pp.97-101: 2876-2879(2010).

DOI: 10.4028/www.scientific.net/amr.97-101.2876

Google Scholar

[11] Wenchao Tian, Linbin Wang, Jianyuan Jia, Csimir forces: Hamaker Rorce and Research of Adhesion snap back, Physics, Vol. 59 (2), 1182-1186(2010), in Chinese.

Google Scholar

[12] Wenchao Tian, Jianyuan Jia: Winger-Seitz Model of Micro-continuity, Physics, Vol. 58 (9), 5930-5935( 2009), in Chinese.

Google Scholar

[13] Yubao Zhang, Qiang Li: COMSOL Multiphysics MEMS-based MEMS-based and Application, (2007, in press), in Chinese.

Google Scholar