Curing Kinetics of Octaepoxysilsesquioxane/DDS System
Polyhedral oligomeric silsesquioxane (POSS) can be incorporated into polymers to obtain organic/inorganic hybrid materials. Octaepoxysilsesquioxane (E-POSS) with eight reactive epoxy groups per molecule is an important kind of POSS. E-POSS was cured with 4,4'-diaminodiphenylsulfone diamine (DDS) in this study. The curing kinetics of the E-POSS/DDS system was studied by using differential scanning calorimetry (DSC). Kinssinger and Flynn-Wall-Ozawa methods were used to obtain the activation energy and pre-exponential factor of the curing reaction.
Zhong Cao, Lixian Sun, Xueqiang Cao, Yinghe He
Z. P. Zhang et al., "Curing Kinetics of Octaepoxysilsesquioxane/DDS System", Advanced Materials Research, Vols. 233-235, pp. 1834-1837, 2011