Curing Kinetics of Octaepoxysilsesquioxane/DDS System

Zeng Ping Zhang; Jian Zhong Pei; Shuan Fa Chen; Hong Zhao Du; Yong Wen

doi:10.4028/www.scientific.net/AMR.233-235.1834

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Curing Kinetics of Octaepoxysilsesquioxane/DDS System
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Modeling of Kinetics and Grain Density Evolution during Isothermal Phase Transformation
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 233-235Curing Kinetics of Octaepoxysilsesquioxane/DDS...

Curing Kinetics of Octaepoxysilsesquioxane/DDS System

Abstract:

Polyhedral oligomeric silsesquioxane (POSS) can be incorporated into polymers to obtain organic/inorganic hybrid materials. Octaepoxysilsesquioxane (E-POSS) with eight reactive epoxy groups per molecule is an important kind of POSS. E-POSS was cured with 4,4'-diaminodiphenylsulfone diamine (DDS) in this study. The curing kinetics of the E-POSS/DDS system was studied by using differential scanning calorimetry (DSC). Kinssinger and Flynn-Wall-Ozawa methods were used to obtain the activation energy and pre-exponential factor of the curing reaction.