Curing Kinetics of Octaepoxysilsesquioxane/DDS System

Abstract:

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Polyhedral oligomeric silsesquioxane (POSS) can be incorporated into polymers to obtain organic/inorganic hybrid materials. Octaepoxysilsesquioxane (E-POSS) with eight reactive epoxy groups per molecule is an important kind of POSS. E-POSS was cured with 4,4'-diaminodiphenylsulfone diamine (DDS) in this study. The curing kinetics of the E-POSS/DDS system was studied by using differential scanning calorimetry (DSC). Kinssinger and Flynn-Wall-Ozawa methods were used to obtain the activation energy and pre-exponential factor of the curing reaction.

Info:

Periodical:

Advanced Materials Research (Volumes 233-235)

Edited by:

Zhong Cao, Lixian Sun, Xueqiang Cao, Yinghe He

Pages:

1834-1837

DOI:

10.4028/www.scientific.net/AMR.233-235.1834

Citation:

Z. P. Zhang et al., "Curing Kinetics of Octaepoxysilsesquioxane/DDS System", Advanced Materials Research, Vols. 233-235, pp. 1834-1837, 2011

Online since:

May 2011

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$35.00

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