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Curing Behavior of Siloxane-Containing Epoxy

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Abstract:

The curing processes of a novelly synthesized siloxane-containing epoxy resin (SE) and bisphenol A diglycidyl ether (CYD-128) were investigated using dynamic differential scanning calorimetry (DSC), and analyzed by three different methods. The results show that while SE has a lower initial curing temperature and a smaller pre-exponential factor than CYD-128, their curing processes belong to first order kinetic reaction. All the three dynamic methods verified mutually reveal that SE with more catalytic hydroxyls possesses lower activation energy and exhibits a stronger curing reactivity than CYD-128.

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Periodical:

Advanced Materials Research (Volumes 233-235)

Pages:

23-26

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.233-235.23

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Online since:

May 2011

Authors:

Wen Bing Sun, Ou Sheng Zhang

Keywords:

Activation Energy, Curing Reactivity, Kinetic, Siloxane-Containing Epoxy Resin

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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