Curing Behavior of Siloxane-Containing Epoxy

Abstract:

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The curing processes of a novelly synthesized siloxane-containing epoxy resin (SE) and bisphenol A diglycidyl ether (CYD-128) were investigated using dynamic differential scanning calorimetry (DSC), and analyzed by three different methods. The results show that while SE has a lower initial curing temperature and a smaller pre-exponential factor than CYD-128, their curing processes belong to first order kinetic reaction. All the three dynamic methods verified mutually reveal that SE with more catalytic hydroxyls possesses lower activation energy and exhibits a stronger curing reactivity than CYD-128.

Info:

Periodical:

Advanced Materials Research (Volumes 233-235)

Edited by:

Zhong Cao, Lixian Sun, Xueqiang Cao, Yinghe He

Pages:

23-26

DOI:

10.4028/www.scientific.net/AMR.233-235.23

Citation:

W. B. Sun and O. S. Zhang, "Curing Behavior of Siloxane-Containing Epoxy", Advanced Materials Research, Vols. 233-235, pp. 23-26, 2011

Online since:

May 2011

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Price:

$35.00

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