Study on Kinetics of Electroless Plating Palladiumon on Ni-P Coatings

Dao Xin Wu; Ying Liu; Zhong Liang Xiao

doi:10.4028/www.scientific.net/AMR.233-235.2840

Paper Titles

Antioxidant Activities of Soluble Dietary Fiber Extracted from Brewers’ Spent Grain
p.2824

Application of Imidazolinylquaternary-Ammonium-Salt Compound Inhibitor for A20 Steel in Hydrochloric Acid Pickling
p.2828

Study on Synthesis and Photocatalytic Activity of Titanium Dioxide/Tungsten Oxide
p.2832

The Study of Polylactic Acid/corn Straw Fiber Composite Cushioning Material by Hot-Press Forming
p.2836

Study on Kinetics of Electroless Plating Palladiumon on Ni-P Coatings
p.2840

Experimental Investigation into the Single-Track of Selective Laser Melting of IN625
p.2844

Evaluation of Antioxidant Activity of Alcoholic Extract from Peanut Hulls
p.2849

Effects of Frozen at Different Time Postmortem and Thawed at Different Thawing Rate on the Production Rate of Chinese Sausage
p.2855

Synthetic Technics of Methyl Acrylate through Aldol Condensation with a Multisubsection Fixed-Bed Reactor
p.2859

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 233-235Study on Kinetics of Electroless Plating...

Study on Kinetics of Electroless Plating Palladiumon on Ni-P Coatings

Abstract:

Single factor method was used to investigate the effects of the main technical parameters ,which was on the Pd deposition rate in electroless Pd plating process. The kinetic equation of palladium deposition was established. When the concentration of EDTA-2Na was less than 6g/L，V= 0.783 C_A^1.00784 C_B^0.15225 Cc^-0.3373 C_D^0.29417exp[10.76×10³(T-298)/(298RT)] .When the concentration of EDTA-2Na was more than 6g/L ,V= 2.147C_A^1.00784 C_B^0.15225 Cc^-0.3373 C_D^-0.33376 exp[10.76×10³(T-298)/(298RT)] .

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 233-235)

Pages:

2840-2843

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.233-235.2840

Citation:

Cite this paper

Online since:

May 2011

Authors:

Dao Xin Wu, Ying Liu, Zhong Liang Xiao

Keywords:

Deposition Rate, Electroless Plating (EP), Kinetic, Palladium

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Jingli Fang .Theory&Application of Compounds in Electroplating[M]. (Beijing: Chemical Industry Press, 2007).

Google Scholar

[2] Schlesinger,Paunovic . Modern Electroplating[M]. (Beijing: Chemical Industry Press, 2006).

Google Scholar

[3] Electroplating Division of China Surface Assocition. Operative technology of Chemical plating[M]. (Beijing: Chemical Industry Press,1999)

Google Scholar

[4] K.L. Yeung, S.C. Christiansen, A. Varma. Journal of Membrane Science 159 (1999) pp.107-122.

Google Scholar

[5] Boquan Jiang,Suping Yang. Chinese Rare Earths.vo1.29.No.2 April 2008,pp.95-99.

Google Scholar

[6] Zhongliang Shi, Shanqiang Wu , Jerzy A Szpunar , Mustapha Roshd. Journal of Membrane Science 280 , In Chinese.(2006) p.705–711.

Google Scholar

[7] Z.H. Ma, K.L. Tan , E.T. Kang. Synthetic Metals 114 (2000)17-25.

Google Scholar

[8] Renato Canha Ambrosio, Edson A. Ticianelli. Surface & Coatings Technology 197 (2005) p.215– 222.

Google Scholar