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Cure Kinetics of Epoxy/DDS/ Epoxy-Grafted Nano-Aluminum Oxide

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Abstract:

The cure kinetics of epoxy/epoxy-grafted nano-aluminum oxide using 4, 4'-diaminodiphenylsulphone (DDS) as the curing agent was studied by nonisothermal differential scanning calorimetry (DSC) at different heating rates. The activation energy (Ea) was determined by Flynn-Wall-Ozawa method, and kinetic model was predicted by Málek method. The Ea values of epoxy/nano-aluminum oxide/DDS systems are generally higher than those of epoxy /DDS. These imply that the addition of nano-aluminum oxide would inhibit the chain mobility of the epoxy resins. Furthermore, autocatalytic model was found to be appropriate to describe the kinetics of above mentioned reactions. The predicted curves fit well with the experimentally obtained curves.

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Periodical:

Advanced Materials Research (Volumes 236-238)

Pages:

2058-2062

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.236-238.2058

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Online since:

May 2011

Authors:

Hong Jun Zhou, Guo Qiang Yin, Miao Hong Zhuang, Jian Fang Ge, Xuan Lin

Keywords:

Cure Kinetics, Differential Scanning Calorimetry (DSC), Epoxy Resin (ER), Nano-Aluminum Oxide

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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