Curing, Thermal Properties and Flame Resistance of Tetrabromo-BPA Epoxy Resin/ Boron-Containing Phenol Resin

Abstract:

In order to improve the properties of boron-containing phenol-formaldehyde resin (BPFR), the tetrabromo-bisphenol A epoxy resin (TBBPAER) was used to cure BPFR. The curing mechanism, thermal properties and the fire resistance of TBBPAER/BPFR were investigated by fourier transform infrared spectrometer (FTIR), thermal gravimetric analysis (TGA), torsional braid analysis (TBA) and the oxygen index method. The results show, -OH of -C₆H₄-CH₂OH and -C₆H₄OH reacts with the epoxy group. With the increase in the amount of BPFR, the thermal properties get better. When the additive amount of TBBPAER is 10 wt%, this material has best thermal stability at high temperature and higher temperature of loss bromine. The glass transition temperature (T_g) is 223.2 °C and the LOI is 68.5.

• Periodical: Advanced Materials Research (Volumes 239-242)
• Pages: 1022-1025
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.239-242.1022
• Online since: May 2011
• Authors: Jun Gang Gao, Xue Fang Zhang, Hong Qiu Lv
• Keywords: Boron-Containing Phenol Resin, Bromo-Epoxy Resin, Fire Resistant

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