Optimizing of Pretreatment Process of Electroless Ni-P Plating on AZ91D Substrate

Abstract:

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In order to improve and simplify the process of electroless Ni-P plating on AZ91D magnesium alloy substrate, pretreatment process and deposite time were optimized by orthogonal test, the plating morphology were analysed using Quanta 200 type scanning electron microscope. The bond between the plating and aluminum substrate were evaluated using method of water quenching and alternating bending test. The results show that good coating can be obtained on AZ91D substrate under the condition of the acid electroless Ni-P plating solution with pickling time of 40-50s, activated time of 10 min. And the good bond between the coating and AZ91D substrate was obtained.

Info:

Periodical:

Advanced Materials Research (Volumes 239-242)

Edited by:

Zhong Cao, Xueqiang Cao, Lixian Sun, Yinghe He

Pages:

1915-1918

DOI:

10.4028/www.scientific.net/AMR.239-242.1915

Citation:

G. J. Liu et al., "Optimizing of Pretreatment Process of Electroless Ni-P Plating on AZ91D Substrate", Advanced Materials Research, Vols. 239-242, pp. 1915-1918, 2011

Online since:

May 2011

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Price:

$35.00

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