Finite Element Study on Temperature Distribution of Curing of Fully Enclosed Adhesive Joint

Zhi Guo Lu; Jian Ping Lin; Dan Dan Hua

doi:10.4028/www.scientific.net/AMR.239-242.398

Paper Titles

A Method about the Worn Materials Applied to the Marine Mechanical and Electronic Equipments in Condition Monitoring
p.380

Process Structure and Properties of Bi-Shrinkage Yarns Spun by one-Step Spinning Process
p.384

Microstructural Study on Ni-Based Alloy Coating on Plain-Carbon Steel Substrate by Hot Dipping Process
p.388

A Method of Improving Limiting Drawing Ratio：Differential Temperature Deep Drawing Based on Superplasticity
p.392

Finite Element Study on Temperature Distribution of Curing of Fully Enclosed Adhesive Joint
p.398

Method Study of Improving Surface Corrosion Resistance of 6063 Aluminum Alloy
p.404

Diallyl Orthophthalate(DAOP) Resin as a Reactive Plasticizer for Optimizing Glass-fiber/PVC Interface and Reactive Kinetics
p.408

Effect of Si Addition on the Microstructures and Mechanical Properties of TiAl Intermetallics
p.413

Study of Friction Stir Spot Welding of Steel/ Magnesium
p.417

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 239-242Finite Element Study on Temperature Distribution...

Finite Element Study on Temperature Distribution of Curing of Fully Enclosed Adhesive Joint

Abstract:

The bonded structures in vehicles are usually in different enclosure conditions. A finite element (FE) model, based on fluid-solid coupling method, has been established for analyzing the temperature distribution of adhesive single-lapped joint when curing in a closed enclosure. The heat transferring process of the adhesive joint in an exposed environment has also been executed for comparison purpose. The FE temperature results of both joints are validated by experiments. It has been found that the joint temperature in a closed enclosure rises much more slowly compared with the joint in an exposed environment within the curing process. Due to the thickness variation along the adhesive joint, it can be observed on both joints the lap area always obtains the lowest temperature while the joint ends obtain the highest ones.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 239-242)

Pages:

398-403

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.239-242.398

Citation:

Cite this paper

Online since:

May 2011

Authors:

Zhi Guo Lu, Jian Ping Lin, Dan Dan Hua

Keywords:

Adhesive Joint, Curing, Enclosure Conditions, Finite Element, Heat Transferring

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] R.A. Dickie, D.R. Bauer: Modeling paint and adhesive cure in automotive applications. Progress in Organic Coatings Vol.31 (1997), P209.

DOI: 10.1016/s0300-9440(97)00039-8

Google Scholar

[2] S. I. Rokhlin: Study of the cure kinetics of structural adhesives by ultrasonic interface waves. Journal of Materials Science Vol.20(1985),P3300.

DOI: 10.1007/bf00545198

Google Scholar

[3] F.J. Campbell, B.A. Rugg: Radiation curing of selected structural adhesives. Radiation Physics and Chemistry Vol.14(1977) :P699.

DOI: 10.1016/0146-5724(79)90105-5

Google Scholar

[4] Ozisik, M. N., Basic Heat Transfer, McGraw-Hill, N. Y. (1977).

Google Scholar

[5] Hu wanghua: New Method on Computing Heat Exchange. Coal Mine Machinery.Vol.129 (2008), P31.

Google Scholar

[6] Huwang: A Study on Conjugate Heat Transfer of Cylinder block cooling Coupled Model in Internal Combustion Engine. Automotive Engineering Vol. 30(2008), P315.

Google Scholar

[7] Qingfang Ma, Wang rongsheng: Practical thermal physical properties manual (China agriculture machine press, China 1986), in Chinese.

Google Scholar

[8] A.Cheung, Y.Yu, K.Pochiraju: Three-dimensional finite element simulation of curing of polymer composites. Finite Elements in Analysis and Design Vol.40 (2004), P895.

DOI: 10.1016/s0168-874x(03)00119-7

Google Scholar

[9] Whitaker, S.:Fundamental Principles of Heat Transfer, Pergamon, N. Y. (1977).

Google Scholar