Finite Element Study on Temperature Distribution of Curing of Fully Enclosed Adhesive Joint

Abstract:

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The bonded structures in vehicles are usually in different enclosure conditions. A finite element (FE) model, based on fluid-solid coupling method, has been established for analyzing the temperature distribution of adhesive single-lapped joint when curing in a closed enclosure. The heat transferring process of the adhesive joint in an exposed environment has also been executed for comparison purpose. The FE temperature results of both joints are validated by experiments. It has been found that the joint temperature in a closed enclosure rises much more slowly compared with the joint in an exposed environment within the curing process. Due to the thickness variation along the adhesive joint, it can be observed on both joints the lap area always obtains the lowest temperature while the joint ends obtain the highest ones.

Info:

Periodical:

Advanced Materials Research (Volumes 239-242)

Edited by:

Zhong Cao, Xueqiang Cao, Lixian Sun, Yinghe He

Pages:

398-403

DOI:

10.4028/www.scientific.net/AMR.239-242.398

Citation:

Z. G. Lu et al., "Finite Element Study on Temperature Distribution of Curing of Fully Enclosed Adhesive Joint", Advanced Materials Research, Vols. 239-242, pp. 398-403, 2011

Online since:

May 2011

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Price:

$35.00

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