Simulation Research of the Effect of Thermal Reflow Processing Parameters on the Profile of Micro-Spherical Structure

Bing Yan Jiang; Lei Chen; Dai Bing Li; Stefan Kirchberg

doi:10.4028/www.scientific.net/AMR.239-242.517

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 239-242Simulation Research of the Effect of Thermal...

Simulation Research of the Effect of Thermal Reflow Processing Parameters on the Profile of Micro-Spherical Structure

Abstract:

In this paper reflow process is integrated into LIGA process in order to realize three dimensional fabrication. The melting and deformation process of photoresist, which has an initial cylindrical shape of D500μm and h66μm, and the influence of various processing parameters on the height of formed microlens, is simulated with Marc. The optimum processing parameters combination is obtained by orthogonal experiment method and the influence of different processing parameters on the height of micro-spherical structure is studied with single factor experiment method. The results showed that the optimum processing parameters combination was 1°C /s for heating rate, 110°C for heating temperature and 45min for holding time; the significance of processing parameters on the micro-spherical structure’s height can be ordered in holding time＞heating rate＞heating temperature.

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Periodical:

Advanced Materials Research (Volumes 239-242)

Pages:

517-523

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https://doi.org/10.4028/www.scientific.net/AMR.239-242.517

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Online since:

May 2011

Authors:

Bing Yan Jiang, Lei Chen, Dai Bing Li, Stefan Kirchberg

Keywords:

Marc Simulation, Micro-Spherical Structure, Processing Parameter, Thermal Reflow

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