Screening Test of Phosphoric Acid-BTA Slurries for Copper ECMP Based on Static Inhibition Efficiency

Abstract:

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An ECMP slurry screening protocol is proposed based on inhibition efficiency of inhibitor in copper static corrosion test, aiming at enhancing the planarization efficiency of copper ECMP slurries. The elctrochemical properties of copper in electrolytes including H3PO4 and BTA with different concentrations are studied basing on Linear Sweep Voltammetry (LSV) and chronoamperometry under static corrosion states. According to analysis of the anodic current, material removal rate (MRR) and inhibition efficiency of BTA, an electrolyte formula of 30 wt% H3PO4+0.01M BTA is sort out and the anodic potential on copper should be set below 0.5 V.

Info:

Periodical:

Advanced Materials Research (Volumes 239-242)

Edited by:

Zhong Cao, Xueqiang Cao, Lixian Sun, Yinghe He

Pages:

920-923

DOI:

10.4028/www.scientific.net/AMR.239-242.920

Citation:

W. J. Zhai and Y. Z. Yang, "Screening Test of Phosphoric Acid-BTA Slurries for Copper ECMP Based on Static Inhibition Efficiency", Advanced Materials Research, Vols. 239-242, pp. 920-923, 2011

Online since:

May 2011

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$35.00

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