Screening Test of Phosphoric Acid-BTA Slurries for Copper ECMP Based on Static Inhibition Efficiency

Abstract:

An ECMP slurry screening protocol is proposed based on inhibition efficiency of inhibitor in copper static corrosion test, aiming at enhancing the planarization efficiency of copper ECMP slurries. The elctrochemical properties of copper in electrolytes including H₃PO₄ and BTA with different concentrations are studied basing on Linear Sweep Voltammetry (LSV) and chronoamperometry under static corrosion states. According to analysis of the anodic current, material removal rate (MRR) and inhibition efficiency of BTA, an electrolyte formula of 30 wt% H₃PO₄+0.01M BTA is sort out and the anodic potential on copper should be set below 0.5 V.

• Periodical: Advanced Materials Research (Volumes 239-242)
• Pages: 920-923
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.239-242.920
• Online since: May 2011
• Authors: Wen Jie Zhai, Yang Zhan Yang
• Keywords: Copper, Electrochemical Mechanical Planarization (ECMP), Inhibition Efficiency, Static Electrochemical Corrosion

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