Screening Test of Phosphoric Acid-BTA Slurries for Copper ECMP Based on Static Inhibition Efficiency
An ECMP slurry screening protocol is proposed based on inhibition efficiency of inhibitor in copper static corrosion test, aiming at enhancing the planarization efficiency of copper ECMP slurries. The elctrochemical properties of copper in electrolytes including H3PO4 and BTA with different concentrations are studied basing on Linear Sweep Voltammetry (LSV) and chronoamperometry under static corrosion states. According to analysis of the anodic current, material removal rate (MRR) and inhibition efficiency of BTA, an electrolyte formula of 30 wt% H3PO4+0.01M BTA is sort out and the anodic potential on copper should be set below 0.5 V.
Zhong Cao, Xueqiang Cao, Lixian Sun, Yinghe He
W. J. Zhai and Y. Z. Yang, "Screening Test of Phosphoric Acid-BTA Slurries for Copper ECMP Based on Static Inhibition Efficiency", Advanced Materials Research, Vols. 239-242, pp. 920-923, 2011