Preparation and Performance Research on Phenolic Insulation Foam Used Low-Temperature Foaming Technology

Abstract:

The phenolic(PF) foams were prepared used low-temperature foaming and curing method. The optimum low-temperature foaming processing technology conditions and material proportioning were described below. The curing temperature was 40 °C, the amount of foaming agent iso-pentane was 8-10wt.%, tween-80 dosage was 6-7wt.%, the amount of composite curing agent was 15-18wt.%.The effects of low-temperature foaming on mechanical properties, heat insulation, fire-retardant, foam hole form and micro-structure were discussed. 40°C and 70°C curing PF foam performance comparison results showed that low-temperature curing technology slightly affect the fire-retardant properties of PF foam. And excellent overall performance PF foam were prepared with 40°C foaming technology, the foam hole morphology structure, toughness and strength of PF foam were better. In addition, the low-temperature curing PF foam had more even foam hole distribution, more regular foam hole structure, more clean foam hole arrangement.

• Periodical: Advanced Materials Research (Volumes 250-253)
• Pages: 450-454
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.250-253.450
• Online since: May 2011
• Authors: Xiao Wei Zhuang, Shou Hai Li, Yu Feng Ma, Wei Zhang, Yu Zhi Xu, Chun Peng Wang, Fu Xiang Chu
• Keywords: Foam Hole Form, Low-Temperature Foaming Technology, Phenolic Foam

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