Preparation and Performance Research on Phenolic Insulation Foam Used Low-Temperature Foaming Technology

Abstract:

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The phenolic(PF) foams were prepared used low-temperature foaming and curing method. The optimum low-temperature foaming processing technology conditions and material proportioning were described below. The curing temperature was 40 °C, the amount of foaming agent iso-pentane was 8-10wt.%, tween-80 dosage was 6-7wt.%, the amount of composite curing agent was 15-18wt.%.The effects of low-temperature foaming on mechanical properties, heat insulation, fire-retardant, foam hole form and micro-structure were discussed. 40°C and 70°C curing PF foam performance comparison results showed that low-temperature curing technology slightly affect the fire-retardant properties of PF foam. And excellent overall performance PF foam were prepared with 40°C foaming technology, the foam hole morphology structure, toughness and strength of PF foam were better. In addition, the low-temperature curing PF foam had more even foam hole distribution, more regular foam hole structure, more clean foam hole arrangement.

Info:

Periodical:

Advanced Materials Research (Volumes 250-253)

Edited by:

Guangfan Li, Yong Huang and Chaohe Chen

Pages:

450-454

DOI:

10.4028/www.scientific.net/AMR.250-253.450

Citation:

X. W. Zhuang et al., "Preparation and Performance Research on Phenolic Insulation Foam Used Low-Temperature Foaming Technology", Advanced Materials Research, Vols. 250-253, pp. 450-454, 2011

Online since:

May 2011

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Price:

$35.00

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