Preparation and Performance Research on Phenolic Insulation Foam Used Low-Temperature Foaming Technology
The phenolic(PF) foams were prepared used low-temperature foaming and curing method. The optimum low-temperature foaming processing technology conditions and material proportioning were described below. The curing temperature was 40 °C, the amount of foaming agent iso-pentane was 8-10wt.%, tween-80 dosage was 6-7wt.%, the amount of composite curing agent was 15-18wt.%.The effects of low-temperature foaming on mechanical properties, heat insulation, fire-retardant, foam hole form and micro-structure were discussed. 40°C and 70°C curing PF foam performance comparison results showed that low-temperature curing technology slightly affect the fire-retardant properties of PF foam. And excellent overall performance PF foam were prepared with 40°C foaming technology, the foam hole morphology structure, toughness and strength of PF foam were better. In addition, the low-temperature curing PF foam had more even foam hole distribution, more regular foam hole structure, more clean foam hole arrangement.
Guangfan Li, Yong Huang and Chaohe Chen
X. W. Zhuang et al., "Preparation and Performance Research on Phenolic Insulation Foam Used Low-Temperature Foaming Technology", Advanced Materials Research, Vols. 250-253, pp. 450-454, 2011