Effect of Continuous Casting Parameters on Microstructure and Texture of Gold Bonding Wire for Semiconductor Packaging

Abstract:

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In this study, we have investigated a texture and microstructure of gold bonding wire by transmission electron microscope, X-ray diffraction and electron back scatter diffraction according to process parameters, such as casting, drawing and annealing processes. The gold was cast into 7mm diameter rods by vertical continuous casting technique, the cast rods were drawn to a final wire size of 25μm, and then the fine wires were annealed. A unidirectional solidification structure having <100> fiber texture of cast rod was strongly developed depending on casting route and speed. In the sample with unidirectional microstructure developed in partial it is found that dislocation substructure with nano-size appeared to display a characteristic feature, while no dislocation substructure is seen in the sample with complete unidirectional microstructure. Interface stability between solid and liquid may be responsible for this difference in dislocation substructure. With decreasing casting speed <100> fiber component became weak. Initial texture plays important role on development of <111> fiber texture at drawing and final annealing stages. On the basis of results obtained it is suggested that both the initial texture are important in controlling the texture of gold bonding wire.

Info:

Periodical:

Advanced Materials Research (Volumes 26-28)

Edited by:

Young Won Chang, Nack J. Kim and Chong Soo Lee

Pages:

589-592

DOI:

10.4028/www.scientific.net/AMR.26-28.589

Citation:

W. Y. Kim et al., "Effect of Continuous Casting Parameters on Microstructure and Texture of Gold Bonding Wire for Semiconductor Packaging", Advanced Materials Research, Vols. 26-28, pp. 589-592, 2007

Online since:

October 2007

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Price:

$35.00

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