A Study on Thermal Fracture Processing Models Applied to Glass Substrate Cutting

Abstract:

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Thermal fracture-cutting technology (TFCT) for brittle materials has become the main technology for LCD glass substrate cutting to meet the low residual thermal stresses requirement. Based on the thermal weight function principle of fracture mechanics, this paper presents thermal weight function distributions for the mode-I and mode-II fracture model, and the fracture phenomenon under a variety of cutting paths, such as tilt crack, split crack, twist crack, and local buckling.

Info:

Periodical:

Advanced Materials Research (Volumes 264-265)

Edited by:

M.S.J. Hashmi, S. Mridha and S. Naher

Pages:

1252-1257

DOI:

10.4028/www.scientific.net/AMR.264-265.1252

Citation:

K. C. Huang et al., "A Study on Thermal Fracture Processing Models Applied to Glass Substrate Cutting", Advanced Materials Research, Vols. 264-265, pp. 1252-1257, 2011

Online since:

June 2011

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Price:

$35.00

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