A Study on Thermal Fracture Processing Models Applied to Glass Substrate Cutting

Kuo Cheng Huang; Min Wei Hung; Shih Feng Tseng; Chi Hung Hwang

doi:10.4028/www.scientific.net/AMR.264-265.1252

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 264-265A Study on Thermal Fracture Processing Models...

A Study on Thermal Fracture Processing Models Applied to Glass Substrate Cutting

Abstract:

Thermal fracture-cutting technology (TFCT) for brittle materials has become the main technology for LCD glass substrate cutting to meet the low residual thermal stresses requirement. Based on the thermal weight function principle of fracture mechanics, this paper presents thermal weight function distributions for the mode-I and mode-II fracture model, and the fracture phenomenon under a variety of cutting paths, such as tilt crack, split crack, twist crack, and local buckling.

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Periodical:

Advanced Materials Research (Volumes 264-265)

Pages:

1252-1257

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.264-265.1252

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Online since:

June 2011

Authors:

Kuo Cheng Huang, Min Wei Hung, Shih Feng Tseng, Chi Hung Hwang

Keywords:

Fracture Mechanic, Thermal Fracture-Cutting Technology, Thermal Weight Function

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