A Study on Thermal Fracture Processing Models Applied to Glass Substrate Cutting
Thermal fracture-cutting technology (TFCT) for brittle materials has become the main technology for LCD glass substrate cutting to meet the low residual thermal stresses requirement. Based on the thermal weight function principle of fracture mechanics, this paper presents thermal weight function distributions for the mode-I and mode-II fracture model, and the fracture phenomenon under a variety of cutting paths, such as tilt crack, split crack, twist crack, and local buckling.
M.S.J. Hashmi, S. Mridha and S. Naher
K. C. Huang et al., "A Study on Thermal Fracture Processing Models Applied to Glass Substrate Cutting", Advanced Materials Research, Vols. 264-265, pp. 1252-1257, 2011