The electrodeposition of tin from Tin (II) Methane Sulfonate (MSA) with varying concentration in air and water stable 1-Butyl-1-Methylpyrrolidinium Trifluoro-Methanesulfonate, (BMPOTF) ionic liquid at room temperature was studied. Cyclic Voltammetry served to characterize theelectrochemical behavior of tin reduction and oxidation. The diffusion coefficient of stannous ions in the mixture of BMPOTF ionic liquid and MSA based electrolyte obtained via Randles- Sevcik was approximately 2.11X 10-7 cm2/s. Electroplating on copper panel was conducted under different current densities to determine BMPOTF based tin plating solution current efficiency. Mixture of BMPOTF and MSA based tin plating solution gave current efficiency as high as 99.9%. The deposit morphology of the mixture BMPOTF and MSA based tin coated substrates was observed by using EDX and SEM. A dense, fine and polygonal grain structure was obtained.