Isothermal Physical Aging of Poly(ethyl methacrylate)/Polyhedral Oligomeric Silsequioxanes Nanocomposite Thin Films

Sil Ro Jin; Jong Keun Lee

doi:10.4028/www.scientific.net/AMR.287-290.2234

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 287-290Isothermal Physical Aging of Poly(ethyl...

Isothermal Physical Aging of Poly(ethyl methacrylate)/Polyhedral Oligomeric Silsequioxanes Nanocomposite Thin Films

Abstract:

The effects of the polyhedral oligomeric silsequioxanes (POSS) in stacked poly(methyl methacrylate) (PMMA) film samples were investigated in two different film thicknesses, ~50 and ~660 nm. The types of the POSS include methacryl-, octaisobutyl-, and octasilane-POSS. The glass transition temperature (T_g) and isothermal physical aging was depressed by the reduction of film thickness. Among POSS molecules used in this work, methacryl-POSS was the greatest effect in both T_g and relaxation enthalpy (DH_Relax) due to the physical aging. The Kohlrausch-Williams-Watts (KWW) relaxation function was used to further understand the effect of POSS and film thickness on the physical aging.

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Advanced Materials Research (Volumes 287-290)

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2234-2239

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https://doi.org/10.4028/www.scientific.net/AMR.287-290.2234

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July 2011

Authors:

Sil Ro Jin, Jong Keun Lee

Keywords:

Isothermal Physical Aging, Nanocomposite, PMMA, POSS, Thin Film

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