Thermal Resistance and Heat Dissipation of LED PCB with Thermal Vias

Hyung Won Shin; Hyo Soo Lee; Seung Boo Jung

doi:10.4028/www.scientific.net/AMR.287-290.789

Paper Titles

High Temperature Creep Behavior of Zn-1.0Cu-0.2Ti Alloy
p.769

Numerical Simulation on Laboratory Triaxial Test of Composite Soil with Roots
p.777

The Design and Case Study of Pervious Concrete Materials
p.781

Dehydration Process of Calcium Silicate Hydrate during Heating in the Air
p.785

Thermal Resistance and Heat Dissipation of LED PCB with Thermal Vias
p.789

Compressive Strength of High Volume Slag Cement Concrete in High Temperature Curing
p.793

The Effect of CFG-Pile Caps and Cushion to Stability of Embankment
p.797

Effects of AgSbO₃ on the Piezoelectric/Dielectric Properties and Phase Transition of Li₂O Doped NKN Lead-Free Piezoelectric Ceramics
p.801

Comparision of Direct Quenching and Reheat Quenching Process on Microstructure and Mechanical Properties of a High Strength Steel
p.805

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 287-290Thermal Resistance and Heat Dissipation of LED PCB...

Thermal Resistance and Heat Dissipation of LED PCB with Thermal Vias

Abstract:

Light Emitting Diode (LED) has been already familiar that is used as lighting sources of general electronic devices and various displays. LED has many advantages such as long life, low power consumption and high reliability. In the future, as alternative to fluorescent lighting, it is sure that LED in lighting products is expected to receive much attention. However, the components related with advanced LED packages or modules have been issued on the heat from LED chip. And the LED chip is still being developed to the high power devices which are generating more heat. In this study, we investigated the variation of thermal resistance in LED modules embedded with thermal via. Through the analysis of thermal resistance with various test vehicles, we could obtain the concrete relationship between thermal resistance and structure of thermal via.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 287-290)

Pages:

789-792

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.287-290.789

Citation:

Cite this paper

Online since:

July 2011

Authors:

Hyung Won Shin, Hyo Soo Lee, Seung Boo Jung

Keywords:

Heat Dissipation, LED, Thermal Resistance, Thermal Via

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Hyo Soo Lee, Sung Ho Son, Choong Sik Lee, Euromat, 2009, Page E13-1

Google Scholar

[2] Mehmet Arik, Charles Becker, Stanton Weaver, and James Petroski, "Thermal management of LEDs: package to system", Proc, SPIE 5187, 64(2004).

Google Scholar

[3] Brombacher, A. C., Reliability of Design-CAE Techniques for Electronic components and Systems, Microelectronics and Reliability, Volume 32, Issue 7, July 1992, Pages 1046-1048

DOI: 10.1016/0026-2714(92)90444-p

Google Scholar

[4] J. D. G. Lacey, D. V. MorCan, Y. H. Aliyu AND H. Thomas. Qual. Reliab. Engng. Int. 16, 45, (2000)

Google Scholar

[5] N. Aizar Abdul Karian, Thermal analysis of LED package, Microelectronics International(MI) 23/1 (2006) 19-25

DOI: 10.1108/13565360610642714

Google Scholar

[6] Victor Adrian Chiriac, Tien-Yu Tom Lee, Thermal Assessment of RF Integrated LTCC Front End Module (FEM), Inter Socitey Conference on Thermal Phenomens, (2002)

DOI: 10.1109/itherm.2002.1012500

Google Scholar

[7] Darvin Edwards, Paul Hundt., Thermal Performance of Tape Based Ball Grid Array Over Molded Packages, IEEE, 1998, Page 738-743

DOI: 10.1109/stherm.1998.660403

Google Scholar

[8] Evaluating Thermal Characteriaztion Accuracy Using CFD Codes-A Package Level Benchmark Study of Icepak and Flotherm, Bret A.Zahn, IEEE, 1998, Page 322-329

DOI: 10.1109/itherm.1998.689581

Google Scholar

[9] Thermal Analysis of High Power LTCC LED with different Heat-via

Google Scholar