Three Dimensional Thermo-Mechanical Model of Different Thermocouple Embedded Modes Analysis

Li Gen Sun; Jia Quan Zhang

doi:10.4028/www.scientific.net/AMR.291-294.263

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 291-294Three Dimensional Thermo-Mechanical Model of...

Three Dimensional Thermo-Mechanical Model of Different Thermocouple Embedded Modes Analysis

Abstract:

The embedded thermocouples have been analyzed with the consideration of their temperature effectiveness and the life of mould plates. Three dimensional FEM models have been adopted to study the effect of different installation of the thermocouples. The thermocouples installation methods, whatever from the back side of the plates or from the top or bottom, have been observed with little effect on the temperature field of the copper plates. But the effective Mises stress and strain are influenced obviously. The maximum stresses have been observed in the area of thermocouples channel with holes from back side of the plates. From this point of view, the holes from top or bottom of the plates are more reasonable.

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Periodical:

Advanced Materials Research (Volumes 291-294)

Pages:

263-268

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.291-294.263

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Online since:

July 2011

Authors:

Li Gen Sun, Jia Quan Zhang

Keywords:

3D Modal, Embedded Mode, Mold Plate, Thermocouple

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