The Thermal and Di-Electric Properties of a Silicone-Based Thermal Pad

Abstract:

The properties of a silicone-based elastomeric thermal pad filled with inexpensive ceramic additives were studied in this research. The effects of the content, particle size and mixing ratio of two additives upon the thermal and di-electrical property of the thermal pad are investigated. The result shows that the higher the content, the higher the thermal and dielectric properties are. In addition, the thermal conductivity of two particles filled thermal pads are higher than that of a single particle filled thermal pad. The thermal conductivity of the two kind of particle sizes (14 and 2 um) of 60 % (vol.) SiC filled thermal pad is the highest (2.14 W/m·K).

• Periodical: Advanced Materials Research (Volumes 295-297)
• Pages: 804-807
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.295-297.804
• Online since: July 2011
• Authors: Wern Shiarng Jou, Chih Feng Hsu, Yu Kun Yeh
• Keywords: Dielectric Constant, Thermal Conductivity (TC), Thermal Interface Materials, Thermal Pad

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