Study on the Factors Influencing Spreading Resistance of Heat Sinks

Da Yong Gao; Jian Xin Zhang; Ping Juan Niu

doi:10.4028/www.scientific.net/AMR.301-303.165

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 301-303Study on the Factors Influencing Spreading...

Study on the Factors Influencing Spreading Resistance of Heat Sinks

Abstract:

The spreading resistance is a very important parameter in the applications of heat sink. The design of electronic devices will fail without considering the influence of the spreading resistance. In this paper, a simple thermal model was simulated by Computational Fluid Dynamics software. Some factors, which have great influence on the spreading resistance, have been analyzed. The spreading resistance decreases significantly with the increasing of the area ratio between the heat source and the base-plate. While the ratio being 1, the spreading resistance reaches the mix value. The greater the thermal conductivity of heat sink, the lower the spreading resistance. With the increasing of the thickness of base-plate, the spreading resistance reduces. However, if the thickness exceeds the critical value, the spreading resistance will increase. And the spreading resistance reaches the mix value while the centers of heat source and the base-plate are overlapped.

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Periodical:

Advanced Materials Research (Volumes 301-303)

Pages:

165-169

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.301-303.165

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Online since:

July 2011

Authors:

Da Yong Gao, Jian Xin Zhang, Ping Juan Niu

Keywords:

Area Ratio, Base-Plate Thickness, Heat Dissipation, Heat Source Position, Spreading Resistance, Thermal Conductivity (TC)

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References

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