Make Use of FPGA to Carry Out Ultrasonic Wave High Definition Nondestructive Thickness Measurement

Wei Jian Yang

doi:10.4028/www.scientific.net/AMR.304.371

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 304Make Use of FPGA to Carry Out Ultrasonic Wave High...

Make Use of FPGA to Carry Out Ultrasonic Wave High Definition Nondestructive Thickness Measurement

Abstract:

This paper discussed the principle of the Nondestructive Thickness Measurement creation of the ultrasonic wave high definition and analyzed the reason that the ultrasonic wave measures a thick accuracy decision factor and error creation. Discussed to make use of FPGA to carry out the error of ultrasonic wave high definition in the common MCU is smaller than a 0.1 mm Nondestructive Thickness Measurement technique principle and carry out a method, kept to get application and realization in the gas well examination in 863 item CNGs.

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Periodical:

Advanced Materials Research (Volume 304)

Pages:

371-375

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.304.371

Citation:

Cite this paper

Online since:

July 2011

Authors:

Wei Jian Yang

Keywords:

Field-Programmable Gate Array (FPGA), Micro Controller Unit (MCU), Nondestructive Thickness Measurement, Transmission Speed, Ultrasonic

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References

[1] Xu Zhihui and so on. Material thin Review of methods of Ultrasonic Thickness Measurement [J]. Physical examination - Physical Volume, 2004. 8 (Vol. 40 No. 8) : 408-414.

Google Scholar

[2] a new ting, Yang Yongqing. Ground Penetrating Radar in road non-destructive thickness measurement of [J]. Detection and monitoring measures. 2009. 2 / 3 (No. 190/192) : 61-64.

Google Scholar

[3] Zhang Hongda, Ma Shiwei. Cr-Mo steel, the average grain size of the ultrasonic nondestructive evaluation [J]. Shanghai University (Natural Science). 2006. 4 (Vol. 12 No. 2) : 162-165.

Google Scholar

[4] Luo Xiaoyan, Tan thick early. Ultrasonic ranging system of anti-interference measures [J]. Jiangxi University of Technology. 2006. 12 (vol. 27, No. 6) : 67-69.

Google Scholar

[5] Renai Feng and so on. FPGA-based embedded system design [M]. Xidian University Press. 2004. 8: 60-129.

Google Scholar