Make Use of FPGA to Carry Out Ultrasonic Wave High Definition Nondestructive Thickness Measurement

Abstract:

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This paper discussed the principle of the Nondestructive Thickness Measurement creation of the ultrasonic wave high definition and analyzed the reason that the ultrasonic wave measures a thick accuracy decision factor and error creation. Discussed to make use of FPGA to carry out the error of ultrasonic wave high definition in the common MCU is smaller than a 0.1 mm Nondestructive Thickness Measurement technique principle and carry out a method, kept to get application and realization in the gas well examination in 863 item CNGs.

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Periodical:

Edited by:

Jerry Tian

Pages:

371-375

DOI:

10.4028/www.scientific.net/AMR.304.371

Citation:

W. J. Yang "Make Use of FPGA to Carry Out Ultrasonic Wave High Definition Nondestructive Thickness Measurement", Advanced Materials Research, Vol. 304, pp. 371-375, 2011

Online since:

July 2011

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$35.00

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