The aim of this study was to investigate the recycling of waste cured epoxy molding compound (c-EMC) which was generated as the mold residue in molding process of electronic component packages, by way of blending the pulverized mold residue with poly (vinyl chloride) (PVC) and other additives to prepare a reproduction composite. The influence of modified and non-modified c-EMC powder on structure and properties of the composites were analyzed by mechanical tests, vicat softening point test (VST) and scanning electron microscopy (SEM). The results showed that simple adding c-EMC powder could improve the stiffness and heat resistance of the composites, though decreased the mechanical strength of the composites. After being pretreated by silane coupling agent γ-aminopropyltriethoxysilane (KH-550), modified c-EMC powder had effective strengthening and toughening effects on the composites with the increasing powder content. Furthermore, better interfacial adhesion and higher VST value of the composites were observed in the presence of KH-550.