Recycling of Thermosetting Epoxy Molding Compound Waste into PVC Composites: Effect of Silane Coupling Agent on Morphology and Physical Properties

Abstract:

The aim of this study was to investigate the recycling of waste cured epoxy molding compound (c-EMC) which was generated as the mold residue in molding process of electronic component packages, by way of blending the pulverized mold residue with poly (vinyl chloride) (PVC) and other additives to prepare a reproduction composite. The influence of modified and non-modified c-EMC powder on structure and properties of the composites were analyzed by mechanical tests, vicat softening point test (VST) and scanning electron microscopy (SEM). The results showed that simple adding c-EMC powder could improve the stiffness and heat resistance of the composites, though decreased the mechanical strength of the composites. After being pretreated by silane coupling agent γ-aminopropyltriethoxysilane (KH-550), modified c-EMC powder had effective strengthening and toughening effects on the composites with the increasing powder content. Furthermore, better interfacial adhesion and higher VST value of the composites were observed in the presence of KH-550.

• Periodical: Advanced Materials Research (Volumes 311-313)
• Pages: 1496-1500
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.311-313.1496
• Online since: August 2011
• Authors: Wen Jiao Xu, Shu Yu Lu
• Keywords: Interface, Modified, Poly(vinyl chloride), Waste Epoxy Molding Compound Powder

References

[1] M. Iji: J. Mater. Sci. Vol. 33(1998), p.45

[2] P. Panyakapo and M. Panyakapo: Waste Manage. Vol. 28(2008), p.1581

[3] Yanhong Zheng, Zhigang Shen, Chujiang Cai, Shulin Ma and Yushan Xing: Mater. Design Vol. 30(2009), p.958

[4] Jie Guo, Qunli Rao and Zhenming Xu: J. Hazard. Mater. Vol. 153(2008), p.728

[5] D. W. Wilson: J. Ind. Tech. Vol. 19(2003), p.2

[6] Wenjiao Xu and Shuyu Lu, in: Proceedings of the 2010 IEEE International Conference on Chemistry and Chemical Engineering, Kyoto, August 2010(IEEE Operations Center, Piscataway, 2010), p.24

[7] Guibin Wang: UPVC Products and Processing (Chemical Industry Press, Beijing 2008). (In Chinese)

[8] B.L. Shah and L.M. Matuana: J. Vinvl Addit. Tech. Vol. 11(2005), p.160

[9] L. M. Matuana, J. J. Balatinecz, and C. B. Park: Polym. Eng. Sci. Vol. 38(1998), p.765

[10] Lianzhen Lin, Mariko Yoshioka, Yaoguang Yao and Nobuo Shiraishi: J. Appl. Polym. Sci. Vol. 55(1995), p.1563