Influence of Milling Process on Internal Stress Measurement in Thick Plate

Su Ming Li; Kai Liao; Pei Yin Luo

doi:10.4028/www.scientific.net/AMR.314-316.1411

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 314-316Influence of Milling Process on Internal Stress...

Influence of Milling Process on Internal Stress Measurement in Thick Plate

Abstract:

Layer removal method is executed by milling process, which may causes deformation and stress change of sample in aluminum alloy thick plate. Through error assessment about the experimental testing process involved milling, the milling stress layer is very thin and fail to change the whole stress dietribution of sample under some technique. Because many times of the loading - unloading operation will increase the deformation error of sample, per-depth of milling is should not be too small for the enhancement of accuracy of data fitting in stress measurement. Finaly, under the conditions of reasonable milling process and scientific experiments, influence of milling process on internal stress measurement can be ignored.

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Periodical:

Advanced Materials Research (Volumes 314-316)

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1411-1414

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.314-316.1411

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Online since:

August 2011

Authors:

Su Ming Li, Kai Liao, Pei Yin Luo

Keywords:

Layer Removal Method, Milling, Stress Measurement, Thick Plate

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