Study on Material Removal Mechanism of Silicon Nitride during ELID Ultraprecision Grinding

Abstract:

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Based on the analyzing ultraprecision grinding process of hard and brittle materials, taking ELID grinding of silicon nitride ceramic as an example, active control technology of passivating films state was introduced in this paper. ELID ultraprecision grinding process respectively at adaptive dynamic balance mode, discontinuous electrolyzing mode and discontinuous grinding mode had been comparatively studied. By means of AFM used for analyzing surface topography of parts, studies show that material removal method for ELID grinding is always a combination of micro brittle fracture, plastic shearing, lapping and polishing action, and which is the main material removal mode depends on the actual grinding contact state. Finally, finishing surface generating mechanism for silicon nitride in ELID ultraprecision grinding was summed up.

Info:

Periodical:

Advanced Materials Research (Volumes 314-316)

Edited by:

Jian Gao

Pages:

1740-1745

DOI:

10.4028/www.scientific.net/AMR.314-316.1740

Citation:

W. D. Jin "Study on Material Removal Mechanism of Silicon Nitride during ELID Ultraprecision Grinding", Advanced Materials Research, Vols. 314-316, pp. 1740-1745, 2011

Online since:

August 2011

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$35.00

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