Development of Measurement and Control System for TLP Bonding

Abstract:

The key to accomplish transient liquid phase bonding in the atmosphere is to control bonding temperature, holding time and compressive pressure. The measurement and control system was independently developed based on an industrial computer and I/O cards. The output of a medium frequency power supply and the opening degree of a proportional relief valve were regulated to control bonding temperature and compressive pressure. Improved PID algorithm was presented, and the temperature precision in steady stage reached ± 0.1%. The system is applied to TLP bond steel pipes successfully.

• Periodical: Advanced Materials Research (Volumes 317-319)
• Pages: 1362-1367
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.317-319.1362
• Online since: August 2011
• Authors: Hong Wang, Qian Yan, Xin Geng Li, Xue Gang Wang, Xiao Ming Wang, Feng Jie Yan
• Keywords: Industrial Computer, Measurement and Control, PID Algorithm, Transient Liquid Phase (TLP) Bonding

References

[1] Duvall D S, Owczarski W A, Paulonis D F. Welding Journal, 1974, 53(4): 203-214.

[2] Jalilian F, Jahazi M, Drew R A L. science and engineering A, 2006,423(1-2): 269-281.

[3] Idowu O A, Richards N L, Chaturvedi M C. Materials science and engineering A, 2005, 397(1-2): 98-112.

[4] Wikstrom N P, Ojo O A,Chaturvedi M C. Materials science and engineering A, 2006, 417(1-2): 299-306.

[5] Information on http://www.advantech.com.cn/

[6] Yonghua Tao, in New PID and application, edited by Machinery Industry Press, Beijing, NY(2004), in press, In Chinese.