Development of Measurement and Control System for TLP Bonding

Abstract:

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The key to accomplish transient liquid phase bonding in the atmosphere is to control bonding temperature, holding time and compressive pressure. The measurement and control system was independently developed based on an industrial computer and I/O cards. The output of a medium frequency power supply and the opening degree of a proportional relief valve were regulated to control bonding temperature and compressive pressure. Improved PID algorithm was presented, and the temperature precision in steady stage reached ± 0.1%. The system is applied to TLP bond steel pipes successfully.

Info:

Periodical:

Advanced Materials Research (Volumes 317-319)

Edited by:

Xin Chen

Pages:

1362-1367

DOI:

10.4028/www.scientific.net/AMR.317-319.1362

Citation:

H. Wang et al., "Development of Measurement and Control System for TLP Bonding", Advanced Materials Research, Vols. 317-319, pp. 1362-1367, 2011

Online since:

August 2011

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Price:

$35.00

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