The Research of the PCB Location Based on Three Layers of MARK Point

Abstract:

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In order to reduce the position error produced by single board assembly and partial uneven surface in automated optical inspection, a new position method based on three layers of MARK point is developed. the first layer is the whole board alignment which compensate the position error of the PCB loading process, the second layer is the single board alignment which compensate the position error of the single board assembly, the last layer is the partial FOV(field of view) alignment which compensate the position error of the partial uneven surface. The experiment result proved the proposed position method improved the position accuracy obviously.

Info:

Periodical:

Advanced Materials Research (Volumes 317-319)

Edited by:

Xin Chen

Pages:

869-876

DOI:

10.4028/www.scientific.net/AMR.317-319.869

Citation:

H. Wu et al., "The Research of the PCB Location Based on Three Layers of MARK Point", Advanced Materials Research, Vols. 317-319, pp. 869-876, 2011

Online since:

August 2011

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Price:

$35.00

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