Solder Selection of Lead-Free Reflow Soldering and Optimization of Craft Curve

Wan Gang Wang; Yong Peng

doi:10.4028/www.scientific.net/AMR.323.70

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 323Solder Selection of Lead-Free Reflow Soldering and...

Solder Selection of Lead-Free Reflow Soldering and Optimization of Craft Curve

Abstract:

Lead-free reflow soldering craft is the most important solder craft in surface mount technology at present. However, the great reduction of crafting window brings challenges to the soldering quality and also poses higher requirement for the stability and reliability of lead-free soldering equipment. This article analyzes problems out of lead-free process, introduces the selecting principle of lead-free solder and analyzes the optimizing gist of temperature curve of lead-free reflow soldering.

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Periodical:

Advanced Materials Research (Volume 323)

Pages:

70-74

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.323.70

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Online since:

August 2011

Authors:

Wan Gang Wang, Yong Peng

Keywords:

Lead-Free, Lead-Free Solder, Reflow Soldering, Temperature Curve

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