Solder Selection of Lead-Free Reflow Soldering and Optimization of Craft Curve

Abstract:

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Lead-free reflow soldering craft is the most important solder craft in surface mount technology at present. However, the great reduction of crafting window brings challenges to the soldering quality and also poses higher requirement for the stability and reliability of lead-free soldering equipment. This article analyzes problems out of lead-free process, introduces the selecting principle of lead-free solder and analyzes the optimizing gist of temperature curve of lead-free reflow soldering.

Info:

Periodical:

Edited by:

Yuhang Yang and Yan Ma

Pages:

70-74

DOI:

10.4028/www.scientific.net/AMR.323.70

Citation:

W. G. Wang and Y. Peng, "Solder Selection of Lead-Free Reflow Soldering and Optimization of Craft Curve", Advanced Materials Research, Vol. 323, pp. 70-74, 2011

Online since:

August 2011

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Price:

$35.00

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