Genesis Analysis of Common Defects of Reflow Soldering and Research for Solutions

Abstract:

To guarantee the quality of surface mounting electronic products, this article analyzes the process features of its four working zones, discusses some main factors which influences the soldering quality of reflow soldering, analyzes the common soldering defects and their causes according to the temperature and process features of reflow soldering during the process of reflow soldering like row-up, bridging, wicking and solder balling. By these measurements, appearance frequency of reflow soldering is effectively reduced and quality of surface mounting electronic products is also raised.

• Periodical: Advanced Materials Research (Volume 323)
• Pages: 79-83
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.323.79
• Online since: August 2011
• Authors: Yong Peng, Wan Gang Wang, Xiao Ping Wang
• Keywords: Reflow Soldering, Soldering Defect, Surface Mounting Technology

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