Tribological Aspects of Chemical Mechanical Polishing Diamond Surfaces

Zhu Ji Jin; Z.W. Yuan; Q. Li; K. Wang

doi:10.4028/www.scientific.net/AMR.325.464

Paper Titles

Ultrasonic Coring of Glass Disks Using Double Core Tool
p.436

Drilling of Borosilicate Glass with Feedback Control Based on Cutting Force
p.442

An Investigation on the Chemical Effect in Chemo-Mechanical Polishing
p.451

Research on the Polishing Performance of CMP Slurry for the Sapphire Crystal
p.457

Tribological Aspects of Chemical Mechanical Polishing Diamond Surfaces
p.464

Precision Polishing of Micro Mold by Using Piezoelectric Actuator Incorporated with Mechanical Amplitude Magnified Mechanism
p.470

Investigation of a Polishing Pad and a Carrier Film for Decreasing Edge Roll Off of Workpiece
p.476

Buffing Performance Analysis of Viscoelastic Polymer with Sensor-Less Polishing Pressure Control
p.482

Verification of Polishing Phenomena of Nickel Cylinder Using Photocatalyst and Luminous Dye Excited by Ultraviolet Ray -Study of Ultraviolet-Ray Aided Machining-
p.489

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 325Tribological Aspects of Chemical Mechanical...

Tribological Aspects of Chemical Mechanical Polishing Diamond Surfaces

Abstract:

Mechanical energy may initiate and accelerate chemical reaction in chemical mechanical polishing (CMP). To study the effect of mechanical energy on the chemical reactions, a special friction measuring system was designed in this paper. The system could measure the local friction to reduce the error caused by resultant force. The effects of rotational speed, polishing pressure and the concentration of oxidant on friction and material removal rate were investigated. The results showed that the system could accurately measure the friction of small area diamond film in CMP process. The frictional system was in a mixed lubrication state since the value of the friction coefficient located in the range of 0.060~0.065.

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Periodical:

Advanced Materials Research (Volume 325)

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464-469

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.325.464

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Online since:

August 2011

Authors:

Zhu Ji Jin, Z.W. Yuan, Q. Li, K. Wang

Keywords:

Chemical Mechanical Polishing (CMP), Diamond, Friction, Polishing Head

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