Investigation of a Polishing Pad and a Carrier Film for Decreasing Edge Roll Off of Workpiece

Urara Satake; Wen Xiao Wang; Toshiyuki Enomoto; Norikazu Tabata

doi:10.4028/www.scientific.net/AMR.325.476

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Precision Polishing of Micro Mold by Using Piezoelectric Actuator Incorporated with Mechanical Amplitude Magnified Mechanism
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Investigation of a Polishing Pad and a Carrier Film for Decreasing Edge Roll Off of Workpiece
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Verification of Polishing Phenomena of Nickel Cylinder Using Photocatalyst and Luminous Dye Excited by Ultraviolet Ray -Study of Ultraviolet-Ray Aided Machining-
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Studies on the Lapping of Polycrystalline Diamond Compact (PDC)
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 325Investigation of a Polishing Pad and a Carrier...

Investigation of a Polishing Pad and a Carrier Film for Decreasing Edge Roll Off of Workpiece

Abstract:

Demand for diminishing edge roll off of workpiece has rapidly increased, especially in polishing silicon wafers and glass disks. However, the conventional polishing technologies cannot meet the demand. To address this problem, the influence of carrier film properties and that of polishing pad properties on the stress distribution near the workpiece edge were investigated using finite element methods. Based on the analytical results, double-layered polishing pads having an extra-fine fiber thin layer and a hard polymer layer were developed. Polishing experiments on silicon wafers and glass plates showed that the developed polishing pads achieved high finishing efficiency and extremely flat surface near the edge.

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Periodical:

Advanced Materials Research (Volume 325)

Pages:

476-481

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.325.476

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Online since:

August 2011

Authors:

Urara Satake, Wen Xiao Wang, Toshiyuki Enomoto, Norikazu Tabata

Keywords:

Edge Roll Off, Finite Element Method (FEM), Flatness, Glass, Polishing, Polishing Pad, Semiconductor, Silicon Wafer

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