Nanoparticle colloid hydrodynamic cavitation jet polishing (HCJP) is a super-smooth machining technology. This technology utilizes the interface reaction to remove material from the workpiece and uses cavitation effect to improve the processing efficiency. In this paper, the prototype equipment of HCJP is researched. Based on the prototype equipment, the processing experiments of pulsed jet nozzle, swirling jet nozzle and common cone-shaped nozzle have been done and the results of the experiments are compared with each other. The experiment results indicate that the roughness of the surfaces polished by three nozzles has remarkably decreased. The material removal rate of pulsed jet nozzle is the highest among the three types of nozzles. The material removal rate of the swirling jet nozzle is not improved obviously compared with the common cone-shaped nozzle. The processing experiment of monocrystalline silicon by the pulsed jet nozzle has been done and the roughness of processed surface is Ra 0.475 nm.