The Deposition Rate of Ti Film by Plasma

Abstract:

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Ti film on AISI 201 was prepared by plasma. The film was characterized by SEM. Their deposition rates were measured by measure the mess of Ti film(m) and the preparation time(t). SEM show that the more time is, the thicker Ti films is. The stronger power is, the thicker Ti films is. And the far the distance is, the more thin Ti films is. It was found that the deposition rates range from 0.02 mg.min-1 to 0.025 mg.min-1 at the area of 6.25cm2. The deposition rate of titanium film change with the deposition power range from 0.021 mg.min-1 to 0.163 mg.min-1. The deposition rate of titanium film change with the deposition power range from 0.096 mg.min-1 to 0.130 mg.min-1. The deposition rate of titanium film change with the deposition negative bias range from 0.008 mg.min-1 to 0.02mg.min-1 at the area of 6.25cm2.

Info:

Periodical:

Advanced Materials Research (Volumes 328-330)

Edited by:

Liangchi Zhang, Chunliang Zhang and Zichen Chen

Pages:

1220-1223

DOI:

10.4028/www.scientific.net/AMR.328-330.1220

Citation:

S. H. Huang and Q. Lai, "The Deposition Rate of Ti Film by Plasma", Advanced Materials Research, Vols. 328-330, pp. 1220-1223, 2011

Online since:

September 2011

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$35.00

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