A Method of MEMS Package Using Local Laser Bonding

Li Cheng; Yi Xin Zhang; Jiao Xu; Ming Yan

doi:10.4028/www.scientific.net/AMR.328-330.1313

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 328-330A Method of MEMS Package Using Local Laser Bonding

A Method of MEMS Package Using Local Laser Bonding

Abstract:

The negative effect of the conventional laser bonding caused by high temperature has been analyzed in the Si-glass bonding process. A new method which is the combination of chip surface activated pre-bonding and laser bonding has been proposed. The method has been used for Micro Electro Mechanical System package experiment. The process is: firstly, a hydrophilic surface was formed by using a special chemical method. Secondly, Si and glass were pre-bonded at room temperature. Finally, the laser with the wavelength of 1.070 μm, spot diameter of 480 μm, power of 70 W was local heated by the laser. This method achieves low-temperature bonding without external press. And the tensile test also shows that the strength of sample bonding reaches 2.8 MPa~3.2 MPa. So it not only ensures the quality of MEMS chip, but also reduces the cost of the package.

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Periodical:

Advanced Materials Research (Volumes 328-330)

Pages:

1313-1316

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.328-330.1313

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Online since:

September 2011

Authors:

Li Cheng, Yi Xin Zhang, Jiao Xu, Ming Yan

Keywords:

Local Laser Bonding, MEMS Package, Pyrex Glass

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