Failure on Multilayered Anisotropic Conductive Films (ACF) Packaging

Abstract:

This paper develops a computational model for predicting the failure probability of multilayered packages fabricated using anisotropic conductive film (ACF). The ACF and NCA are stacked layers by layers, and spaced with each other. The analyzed pads array 10x10 combined with specified geometry parameters in the IC/ Substrate are used to analyze the failure probability. The computational results indicate that the multilayered analysis developed in this study can provide lower failure probability by means of reducing bridging effects for improving the ACF packaging yield.

• Periodical: Advanced Materials Research (Volumes 341-342)
• Pages: 68-72
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.341-342.68
• Online since: September 2011
• Authors: Chao Ming Lin, Tzu Chao Lin, Li Ming Chu
• Keywords: Anisotropic Conductive Film (ACF), Failure Probability, Multilayer, Non-Conductive Adhesive (NCA), V-Shaped Curve

References

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