Failure on Multilayered Anisotropic Conductive Films (ACF) Packaging
This paper develops a computational model for predicting the failure probability of multilayered packages fabricated using anisotropic conductive film (ACF). The ACF and NCA are stacked layers by layers, and spaced with each other. The analyzed pads array 10x10 combined with specified geometry parameters in the IC/ Substrate are used to analyze the failure probability. The computational results indicate that the multilayered analysis developed in this study can provide lower failure probability by means of reducing bridging effects for improving the ACF packaging yield.
C. M. Lin et al., "Failure on Multilayered Anisotropic Conductive Films (ACF) Packaging", Advanced Materials Research, Vols. 341-342, pp. 68-72, 2012