The rapid growth of modern technology place greater demand on electronic products’ performance and quality. As for the printed circuit board (PCB) assembly of electronic components through surface mounting technology (SMT), high-pixel charge coupled device (CCD) can only screen local images during image collection because of its limited vision. A rapid image mosaic technology has been proposed to seamlessly stitch the local images with overlapping boundaries. The complete image of PCB assembly has been acquired through rapid area matching method within double Mark points and Mark circle. The experiment results show that this method can greatly reduce the image-mosaic time and fairly improve the real-time performance of modern automatic optical inspection (AOI) equipment. Furthermore, such method avoids the alignment error from the characteristic points for noise jamming or noise shielding, and therefore obtains better robustness.