Simulation for Microwave Nondestructive Detection of Thickness and Delamination in Layered-Dielectric in Metallic Substrate

Yu E Yang; Cun Fu He; Bin Wu

doi:10.4028/www.scientific.net/AMR.346.764

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Use the Combination Finite Element Method to Solve the Crack Cylinder of the Torsion Problem
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 346Simulation for Microwave Nondestructive Detection...

Simulation for Microwave Nondestructive Detection of Thickness and Delamination in Layered-Dielectric in Metallic Substrate

Abstract:

Microwaves penetrate inside of low loss dielectric materials and they are sensitive to the presence of internal interfaces and non-uniformities. This allows microwave nondestructive inspection techniques to be utilized for inspecting dielectric in metallic substrate. This article simulated Microwave inspecting thickness and delamination in layered-dielectric in metallic substrate, using open-ended rectangular waveguide probe. Effective reflection coefficient of microwave is used in the detection and evaluation to thickness or delimination in the media. This paper optimized the detection frequency and standoff, which provide a reference for the experimental study.

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Periodical:

Advanced Materials Research (Volume 346)

Pages:

764-771

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.346.764

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Online since:

September 2011

Authors:

Yu E Yang, Cun Fu He, Bin Wu

Keywords:

Delamination, Frequency, Layered-Dielectric, Metallic Substrate, Standoff Distance, Thickness

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