Research Progress on Packaging Thermal Management Techniques of High Power LED

Abstract:

In order to dominate the lighting market, LED needs more electrical power to be driven for higher brightness, thereby increasing thermal power dissipation, which contributes to a high heat flux of 85W/cm² within a recent typical high power LED chip. And the junction temperature has direct influence upon the light output efficiency, device life time, emitting wavelength and reliability of LED. Therefore, effective removal of heat to maintain a safe junction temperature is the key to meet the future flux per LED requirements. Compared with other individual thermal resistances along the thermal path, thermal design for much lower packaging thermal resistance is more critical to improve the performances of LED. In this paper, major present technical researches on packaging thermal management were analyzed for high power LED, and the advantages and shortcomings of these techniques were respectively summarized. Besides, some suggestions were provided for further research in this area.

• Periodical: Advanced Materials Research (Volumes 347-353)
• Pages: 3989-3994
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.347-353.3989
• Online since: October 2011
• Authors: Jian Xin Zhang, Ping Juan Niu, Da Yong Gao, Lian Gen Sun
• Keywords: Heat Dissipation, High Power LED, Junction Temperature, Packaging Thermal Management, Thermal Resistance

References

[1] J. Petroski: Proc. of SPIE, Vol. 4776(2002), p.215

[2] M. Arik, J. Petroski and S. Weaver: Proc. of IEEE Int. Soc. Conference Thermal Phenomena, (2002), p.113

[3] N. Narendran, Y. Gu, J. P. Freyssinier, H. Yu and L. Deng: J. Cryst. Growth, Vol. 268(2004), p.449

[4] L. Kim, J. H. Choi, S. H. Jang and M. W. Shin: Thermochimica Acta, Vol. 455(2007), p.21

[5] S. J. Hon, C. T. Kuo, T. P. Chen and M. H. Hsieh: Proc. of SPIE, Vol. 6694(2008), p.1

[6] Y. C. Lin, N. Tran, Y. Zhou, Y. He and F. G. Shi: International Microsystems, Packing, Assembly Conference, (2006), p.1

[7] Information on http://www.philips lumileds.com/pdfs/ab23.pdf

[8] Ting Cheng, Xiaobing Luo, Suyi Huang and Sheng Liu: Int. J. Therm. Sci., Vol. 49(2010), p.196

[9] L. Yang, S. Jang, W. Hwang and M. Shin: Thermochimica Acta, Vol. 455(2007), p.95

[10] A. Y. Kim, W. Götz, D. A. Steigerwald, et al: phys. stat. sol. (a), Vol. 188(2001), p.15

[11] Da Su and Demiao Wang: Semiconductor Technology, Vol. 39(2007), p.742 (In Chinese)

[12] Jianzheng Hu, Lianqiao Yang, M. W. Shine: IEEE Transactions on Device and Materials Reliability, Vol. 8(2008), p.297

[13] S. G. Lee, H. J. Hahm, D. Y. Kim, U.S. Patent 2007,176,198 (A1). (2007)

[14] Demiao Wang, Da Su, Yaoming Wang: Proceeding of the 8th Vacuum Metallurgy and Surface Engineering Conference, (2007), p.182

[15] Information on http://www.led-lightspot.com/led-Patent-Advantage-COB.htm

[16] C. K. Liu, M. J. Dai, C. K. Yu and S. L. Kuo: International Microsystems, Packaging, Assembly and Circuits Technology Conference, (2007), p.29

[17] L. Rushing, A. Shakouri, P. Abraham and J. E. Bowers: Proceedings of the 16th International Conference on Thermoelectrics, (1997), p.646