Microstructure and Properties of WCP/Cu Layered Functionally Graded Materials Prepared by Vacuum Hot-Pressed Sintering

Rong Xin Guo; Feng Yan; Hai Ting Xia

doi:10.4028/www.scientific.net/AMR.378-379.47

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 378-379Microstructure and Properties of WCP/Cu Layered...

Microstructure and Properties of WC_P/Cu Layered Functionally Graded Materials Prepared by Vacuum Hot-Pressed Sintering

Abstract:

The aim of this study is to fabricate WCp/Cu functionally graded materials (FGMs) and test its properties. Vacuum Hot-pressed Sintering technique is used to develop the graded WC particle reinforced Cu matrix composite. Using powder layering technique, a multi-layered WCp/Cu FGM have been prepared successfully. Scanning electron microscopy is used for microstructural analysis. Microscopic observations display that the microstructure of WCp/Cu FGM distribute gradually, and have no visible macroscopic interface. The mechanical properties of WCp/Cu functionally graded materials have been investigated, including Vickers's hardness, Young’s modulus and Tensile strength. Experimental results show that the properties of WCp/Cu FGM strongly depend on compositional variation.

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Periodical:

Advanced Materials Research (Volumes 378-379)

Pages:

47-50

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.378-379.47

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Online since:

October 2011

Authors:

Rong Xin Guo, Feng Yan, Hai Ting Xia

Keywords:

Functionally Graded Material (FGM), Mechanical Property, Microstructural Characterization, Vacuum Hot-Pressed Sintering

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