Applied Materials and Electronics Engineering

Applied Materials and Electronics Engineering

Description:

Volume is indexed by Thomson Reuters CPCI-S (WoS).
This two-volume set, comprising 172 peer-reviewed papers, covers the latest advances in applied mechanics and materials, structural and new functional materials, environmental materials, geotechnical and building materials, electronic materials and applications, new materials and composite materials and other related fields. Combined with its wide coverage of applications, this collection will be welcomed by anyone working in these fields.

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Info:

Editors:
Brendan Gan, Yu Gan and Y. Yu
THEMA:
PHV, TGM
BISAC:
TEC021000
Details:
Selected, peer reviewed papers from the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), January 18-19, 2012, HongKong
Pages:
850
Book Set:
2 Books set
Year:
2012
ISBN-13 (softcover):
9783037852880
ISBN-13 (CD):
9783037951132
ISBN-13 (eBook):
9783038137566
Permissions CCC:
Permissions PLS:
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Review from Ringgold Inc., ProtoView: From the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), held in January 2012 in Hong Kong, the 172 papers presented here focus on developments in applied mechanics and materials, structural and new functional materials, environment and materials, geotechnical and building materials, electronic materials and applications, new and composite materials, and other related fields, with an emphasis on basic methodologies, scientific development, and engineering applications. Contributors are engineering researchers and practitioners from academia, industry, and government mainly in China.