Failure Prevention on Application of Flexible Printed Circuits

Ping Liu; Xiao Long Gu; Xiao Gang Liu; Xin Bing Zhao

doi:10.4028/www.scientific.net/AMR.383-390.4648

Paper Titles

Tackling Means for Balancing the Production Lines
p.4620

Control of Crisis Environments by the Use of WSN Structures and Based on Expert-SOA Architecture
p.4629

An Analytical Approach to Ring Rolling Using Modified Slab Analysis
p.4634

Fundamental Necessities of Knowledge Management in Project Based Firms
p.4642

Failure Prevention on Application of Flexible Printed Circuits
p.4648

The Impact of Using Data Warehouse on Manpower Employment Decision Support System
p.4653

Web Application for Virtual-Making of Cost Domain in Process of Civil-Project E-Management by Suggestive Algorithms
p.4660

Parametric Optimization of TIG Welding on 316L Austenitic Stainless Steel by Grey-Based Taguchi Method
p.4667

Investigations on Fume Formation Rate in Shielded Metal Arc Welding Process Using Different Electrodes
p.4672

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 383-390Failure Prevention on Application of Flexible...

Failure Prevention on Application of Flexible Printed Circuits

Abstract:

With the compact nature and the high electrical-connection density, flexible printed circuits (FPC) can achieve considerable weight, space and cost savings over the use of traditional rigid printed circuit boards. In recent years, it becomes impossible without flexible printed circuit technology in electronic products especially for Flip mobile phones. Whereas, its application is not always satisfied the engineering of assembly and reliability due to the existing of mechanical stress in soldering process and service environment. In this paper, through analyzing the common failures in mass production including via interconnection, trace crack and black pad, some preventions were suggested to improve the quality and reliability at the aspect of manufacture, process, mechanical design and dynamic stress distribution philosophy.

You might also be interested in these eBooks

Manufacturing Science and Technology, ICMST2011

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 383-390)

Pages:

4648-4652

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.383-390.4648

Citation:

Cite this paper

Online since:

November 2011

Authors:

Ping Liu, Xiao Long Gu, Xiao Gang Liu, Xin Bing Zhao

Keywords:

Black Pad, Flexible Printed Circuits (FPC), Mechanical Damage, Overstress, Trace Crack

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Kuldip Johal, Hugh Roberts, Electroless Nickel/Immersion Gold technology for improved ductility of flex and rigid-flex applications, Pan Pacific Symposium, (2005).

Google Scholar

[2] Liu Janet, V226 Flex cable broken problem fix, Motorola internal technical symposium 2005, 86-90.

Google Scholar

[3] Sun Junling, Flip flex improvement in Hainan project, Motorola internal technical symposium, 2006, pp.1523-1533.

Google Scholar

[4] Fjelstad, Joseph (1999) Flexible circuitry – technology background and important fundamental issues, Circuit World, Vol. 25, No. 2, pp.6-10.

DOI: 10.1108/03056129910258207

Google Scholar

[5] Mac Zhi, The Reliability assessment for triplet P-Flex trace cracked issue, Motorola internal technical symposium, 2004, pp.1017-1021.

Google Scholar

[6] Paul Reid, Gareth Parry and Paul Andrews, Microvia failure in Lead-Free assembly, Parts 1 and 2, 2006 printed circuit design&manufacture, http: /www. pcdandf. com/cms/magazine/95/2712.

Google Scholar

[7] Rock Hill, Black pad versus brittle fracture, 2002, ATOTECH.

Google Scholar