Electroless Plating of Gold by Using “Au—Amino Acid” Complex

Abstract:

A novel chemical deposition process based on aurous-glycine complex was reported in this paper. By using single factor’s and orthogonal experiments the optimal plating index has been gotten and they are: pH=4~6,[Au]=1.5~2.5 g/L , temperature 40~55 Ċ and plating time 6~8min respectively. Deposition results and quality inspection of the plated panels show that its plating rate is as fast as that of the gold-cyanide complex and reaches 0.020~0.025 um/min, and the quality related parameters including appearance, adhesion power and gold thickness can meet the standard of the modern PCB products.

• Periodical: Advanced Materials Research (Volumes 396-398)
• Pages: 1914-1917
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.396-398.1914
• Online since: November 2011
• Authors: De Liang Li, Jie Luo, Li Lu Han, Yun Peng, Di Yuan Zhong
• Keywords: Cyanide-Free, Electroless Plating (EP), Gold-Amino Acid Complex, PCB

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