Microstructure Modeling for Prediction of Thermal Expansion Coefficient of Plain Weave C/SiC Considering Manufacturing Porosities

Sheng Li Lv; Qing Na Zeng; Lei Jiang Yao; Xiao Yan Tong

doi:10.4028/www.scientific.net/AMR.399-401.315

Paper Titles

Effect of Hot Rolling Deformation on Superplastic Deformation Behavior of TiN_P/2014Al Composite
p.294

Preparation and Characterization of Monocrystal Nano-Sliver Lamella
p.300

The Physical and Mechanical Behavior of Hot Press Mould WPCs
p.305

Ni-Coated Carbon Nanotubes/Mn-Zn Ferrite Composite as Viable Microwave Absorbing Materials
p.310

Microstructure Modeling for Prediction of Thermal Expansion Coefficient of Plain Weave C/SiC Considering Manufacturing Porosities
p.315

The Research on Polyxymethylene Silicon Oxide Whisker Polybasic Thermal Stabilizes Composite Material
p.320

Synthesis and Characterization of Hybrid Polymer PAFC–CPAM
p.327

Effect of Sintering Temperatures on the Reaction-Bonded Si₃N₄/SiC Composite Ceramics
p.331

Formation of Decarbonization Layer and its Effect on Corrosion Resistance of Zirconia Graphite Materials
p.336

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 399-401Microstructure Modeling for Prediction of Thermal...

Microstructure Modeling for Prediction of Thermal Expansion Coefficient of Plain Weave C/SiC Considering Manufacturing Porosities

Abstract:

The aim of this paper is to propose a microstructure modeling for prediction of thermal conductivity of plain weave C/SiC fibre bundles considering manufacturing flaws. Utilizing photomicrographs taken by scanning electron microscope (SEM), we established an accurate sub representative volume element (sub-RVE) model for carbon fiber bundles and RVE for the plain weave C/SiC composite with consideration of four classes of manufacturing porosity. The thermal expansion coefficient of carbon fibre bundles on axial and transverse coefficient of thermal expansion is calculated, respectively. Based on which thermal expansion coefficient of plain weave C/SiC is obtained with the value of 2.71×10^-6 in-plain, which has a good correlation with experimental value. The influences of different manufacturing flaws on material’s thermal expansion coefficient are studied. The study shows that as the matrix porosity or crack volume fraction is increasing, thermal expansion coefficient of plain weave C/SiC is decreasing correspondingly while the speed gradually slows.