Studies on Shielded Active Gas Forge Welded API 5CT L80 Material at Different Cooling Rates

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Shielded Active Gas Forge Welding (SAG-FW) is a solid state bonding process in which two mating surfaces are locally heated and forged together to form a bond. SAG-FW has so far mainly been used to join materials for pipe-line and casing applications. The present study has been conducted on an API 5CT L80 grade material in a prototype forge welding machine. Small-scale pipe specimens have been extracted from the wall of the production casing. The SAG-FW process is completed within a few seconds of heating and forging followed by controlled cooling. The microstructure of the weld is determined by the processing parameters. In this paper, microstructure results for SAG-FW processed L80 material have been obtained for a range of cooling rates and systematically compared with microhardness values. Microstructure observations at different regions of the weld have been made. Faster heating rate and controlled cooling resulted in a mixture of non equilibrium microstructures, but satisfactory mechanical properties have been obtained for optimized processing parameters.

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871-876

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November 2011

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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[1] P.T. Moe, S. Abtahi, Ganesan S. M, S. Støren and W. Rudd; International Journal of Material Forming., Vol. 1 (2008), p.13.

Google Scholar

[2] Ganesan S. M, P.T. Moe, P. Vinothkumar, J.I. Audestad, B. Salberg, H. Valberg, J.K. Solberg, J.S. Burnell-Grey and W. Rudd; International Journal of Material Forming., Vol. 3 (2010), p.343.

DOI: 10.1007/s12289-010-0777-1

Google Scholar

[3] Bodnar, R. and S. Hansen; Metallurgical and Materials Transactions A, Vol. 25A (1994), p.665.

Google Scholar

[4] A. Al Shahrani, T.S., A. Dehghan-Manshadi, J. Williams and E. Pereloma; Materials Science Forum, Vol. 654-656, p.298.

DOI: 10.4028/www.scientific.net/msf.654-656.298

Google Scholar